TSMC EU OIP Ecosystem Forum (In-Person Event)

Learn About:

• Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes
• Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS^®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications
• Comprehensive design solutions for specialty technologies enabling ultra-low power, ultra-low voltage, analog migration, RF, mmWave, and automotive designs targeting 5G, automotive, and IoT designs
• Ecosystem-specific AI-assisted design flow implementations for 2D and 3DIC design productivity and optimization
• Successful, real-life applications of design technologies, IP solutions, and cloud-based designs from TSMC’s Open Innovation Platform^® Ecosystem members and TSMC customers to speed up time-to-design and time-to-market.

For more information on the TSMC OIP Ecosystem Forum, e-mail us at: tsmcevents@tsmc.com.

We look forward to seeing you at the 2024 TSMC OIP Ecosystem Forum!

REGISTER HERE