Chiplets Reach an Architectural Turning Point at Chiplet Summit 2026

The semiconductor industry’s transition toward chiplet-based architectures is entering a decisive new phase. What began as a promising alternative to SoC design is now confronting real-world demands around system integration, validation, and long-term scalability. At Chiplet Summit 2026, taking place February 17–19 in Santa Clara, California, Menta will play a prominent role in addressing these challenges, marking its third consecutive year of participation at the event.

Menta, a semiconductor IP and platform company with more than 15 years of experience in programmable and adaptable silicon architectures, has positioned itself as a key architectural voice in the evolving chiplet ecosystem. Originally known for its pioneering work in embedded FPGA (eFPGA) technology, the company has expanded its focus to system-level challenges in advanced and chiplet-based designs. Its continued presence at the Chiplet Summit reflects the industry’s broader shift from conceptual enthusiasm toward industrial validation and deployment.

At Chiplet Summit 2026, Menta returns at what it describes as a pivotal moment. As chiplets move from architectural concepts into production-oriented systems, the dominant challenges are no longer limited to packaging or interfaces. Instead, issues such as architectural coherence, validation under real operating conditions, and the ability to manage heterogeneous systems over long lifecycles are coming to the forefront. Menta will address these topics through a technical presentation, participation in a panel discussion, and on-site engagement at Booth #316.

The company’s technical presentation will focus on architectural decision-making and system-level trade-offs required to design scalable chiplet hubs. These hubs must support long-lived systems while balancing performance, power efficiency, and adaptability. Complementing this, Menta will take part in the panel discussion titled “Selecting the Right Chiplets for Your Edge Application,” which explores how constraints such as power budgets, cost sensitivity, security requirements, communication needs, and limited update cycles shape chiplet choices as intelligence increasingly shifts to the edge.

A central theme of Menta’s participation is the growing need for platforms that go beyond theoretical interoperability. As the chiplet ecosystem matures, the industry faces a critical gap: the lack of environments capable of measuring, comparing, and de-risking modular designs under real-world conditions. Without such platforms, architectural decisions remain difficult to validate before industrial deployment. Menta argues that this gap must be addressed for chiplets to fulfill their promise at scale.

This is where MOSAICS, Menta’s modular chiplet development and validation platform, takes center stage. Initiated at Chiplet Summit 2024, MOSAICS was created to overcome the limitations of monolithic SoC design by providing a universal chassis with standardized interfaces for heterogeneous chiplet systems. By 2026, the platform has reached a significant new phase. A development kit and evaluation platform are scheduled to become available by summer 2026, enabling early adopters to explore and validate modular configurations. The first platform tape-out is planned for the first quarter of 2027, marking a concrete step toward industrial deployment.

MOSAICS is designed to allow real-world measurement and validation of chiplet-based systems, accelerating development cycles and reducing non-recurring engineering costs, particularly for edge and automotive, class applications. By translating architectural vision into an executable platform, Menta aims to provide the structure needed to turn chiplet strategies into reliable, scalable products.

“As chiplets mature, the industry needs fewer promises and more structure,” said Vincent Markus, CEO of Menta, emphasizing the shift from idea-driven discussions to architecture shaping and validation. This perspective underscores Menta’s broader message at Chiplet Summit 2026: the future of chiplets will be defined not only by openness and modularity, but by the ability to prove designs in realistic conditions before they reach production.

Through its technical contributions, platform roadmap, and ongoing engagement with the ecosystem, Menta’s presence at Chiplet Summit 2026 highlights an industry at an architectural turning point, where validation, coherence, and execution are becoming just as critical as innovation itself.

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