In 2014 Apple released the iPhone 6 which included the first SoC built on a TSMC (20nm) process. This phone started what many call a “Super Cycle” of people upgrading. According to Apple, they now have more than 1 billion activated devices so this super cycle could be seriously super, absolutely.… Read More
High Bandwidth Memory ASIC SiPs for Advanced Products!
When someone says, “2.5D packaging” my first thought is TSMC and my second thought is Herb Reiter. Herb has more than 40 years of semiconductor experience and he has been a tireless promoter of 2.5D packaging for many years. Herb writes for and works with industry organizations on 2.5D work groups and events at conferences… Read More
TSMC OIP Ecosystem Forum 2017 Preview!
The TSMC OIP Ecosystem Forum is upon us again. I have yet to meet a disappointed attendee so it is definitely worth your time: Networking with more than 1,000 semiconductor professionals, the food, mingling with the 50+ EDA, IP, and Services Companies, the food, and of course the content. The 7nm and 7nm EUV updates alone are worth… Read More
Applying ISO 26262 in a Fabless Ecosystem – DAC Panel Discussion
The fabless movement was instrumental in disaggregating the semiconductor industry. Vertical product development at the chip and system level has given way to a horizontal structure over the years. This organization of product development has been doing an admirable job of delivering extremely reliable products. However… Read More
Standard Node Trend
I have previously published analysis’ converting leading edge logic processes to “standard nodes” and comparing standard nodes by company and time. Recently updated details on the 7nm process node have become available and in this article, I will revisit the standard node calculations and trends.… Read More
Designing at 7nm with ARM, MediaTek, Renesas, Cadence and TSMC
The bleeding edge of SoC design was on full display last month at DAC in Austin as I listened to a panel session where members talked about their specific experiences so far designing with the 7nm process node. Jim Hogan was the moderator and the panel quickly got into what their respective companies are doing with 7nm technology already.… Read More
TSMC Unveils More Details of Automotive Design Enablement Platform
At this year’s Design Automation Conference (DAC), TSMC unveiled more details about the design enablement platforms that were introduced at their 23[SUP]rd[/SUP] annual TSMC Technology Symposium earlier this year. I attended a presentation on TSMC’s Automotive Enablement Platform held at the Cadence Theater where TSMC’s… Read More
TSMC @ #54DAC!
TSMC has been an ardent supporter of DAC for the last 18 years which has brought in the other foundries because, as the industry leader, wherever TSMC goes the other foundries naturally follow. The exception of course is Intel Custom Foundry because they march to the beat of a different drummer, if you know what I mean. The CoFluent… Read More
Live from the TSMC Earnings Call!
Last week I was invited to attend the TSMC earnings call at the Shangri-la Hotel in Taipei which was QUITE the experience. I generally listen in on the calls and/or read the transcripts but this was the first one I attended live. I didn’t really know what to expect but I certainly did NOT expect something out of Hollywood. Seriously,… Read More
TSMC Design Enablement Update
A couple of recent semiwiki articles reviewed highlights of the annual TSMC Technical Symposium recently held in Santa Clara (links here, here, and here). One of the captivating sessions at every symposium is the status of the Design Enablement for emerging technologies, presented at this year’s event by Suk Lee, Senior… Read More