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TSMC Banner 2023 
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TSMC
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Shootout at 22nm!

Shootout at 22nm!
by Scotten Jones on 04-03-2017 at 4:00 pm
Categories: Events, FD-SOI, FinFET, Foundries, GlobalFoundries, Intel, IoT, Samsung Foundry, TSMC

For an industry that drives improvement at an exponential rate it is funny how often something old is new again. Intel went into high volume production on 22nm in 2011, and TSMC and Samsung have both had 20nm technologies in production for several years. And yet, recently we have seen renewed interest in 22nm. GLOBALFOUNDRIES has… Read More

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Intel Manufacturing Day: Nodes must die, but Moore’s Law lives!

Intel Manufacturing Day: Nodes must die, but Moore’s Law lives!
by Scotten Jones on 03-29-2017 at 4:00 pm
Categories: FD-SOI, FinFET, Foundries, GlobalFoundries, Intel, Samsung Foundry, TSMC

Yesterday I attended Intel’s manufacturing day. This was the first manufacturing day Intel has held in three years and according to Intel their most in depth ever.

Nodes must die
I have written several articles comparing process technologies across the leading-edge logic producers – GLOBALFOUNDRIES, Intel, Samsung… Read More

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Top 10 Updates from the TSMC Technology Symposium, Part I

Top 10 Updates from the TSMC Technology Symposium, Part I
by Tom Dillinger on 03-22-2017 at 7:00 am
Categories: Events, Foundries, TSMC

Last week, TSMC held their 23rd annual technical symposium in Santa Clara. In the Fall, TSMC conducts the OIP updates from EDA/IP partners and customers. The theme of the Spring symposium is solely on TSMC’s technology development status and the future roadmap. Indirectly, the presentations also provide insight into … Read More

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TSMC Talks About 22nm, 12nm, and 7nm EUV!

TSMC Talks About 22nm, 12nm, and 7nm EUV!
by Daniel Nenni on 03-16-2017 at 12:00 pm
Categories: Events, FinFET, Foundries, TSMC

The TSMC Symposium was jam-packed this year with both people and information. I had another 60 minutes of fame in the Solido booth where I signed 100 books, thank you to all who stopped by for a free book and a SemiWiki pen. SemiWiki bloggers Tom Dillinger and Tom Simon were also there so look for more TSMC Symposium blogs coming in the… Read More

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TSMC Design Platforms Driving Next-Gen Applications

TSMC Design Platforms Driving Next-Gen Applications
by Daniel Nenni on 03-03-2017 at 7:00 am
Categories: AI, Automotive, FinFET, Foundries, IoT, Mobile, TSMC

Coming up is the 23rd annual TSMC Technology Symposium where you can get first-hand updates on advanced and specialty technologies, advanced backend capabilities, future development plans, and network with hundreds of TSMC’s customers and partners. This year the Silicon Valley event kicks off at the Santa Clara Convention… Read More

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EUV is NOT Ready for 7nm!

EUV is NOT Ready for 7nm!
by Daniel Nenni on 02-27-2017 at 8:00 am
Categories: Events, Foundries, GlobalFoundries, Intel, Samsung Foundry, TSMC

The annual SPIE Advanced Lithography Conference kicked off last night with vendor sponsored networking events and such. SPIE is the international society for optics and photonics but this year SPIE Advanced Lithography is all about the highly anticipated EUV technology. Scotten Jones and I are at SPIE so expect more detailed… Read More

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SPIE Advanced Lithography and Synopsys!

SPIE Advanced Lithography and Synopsys!
by Daniel Nenni on 02-01-2017 at 7:00 am
Categories: EDA, Events, Intel, Samsung Foundry, Synopsys, TSMC

SPIE is the premier event for lithography held in Silicon Valley and again Scotten Jones and I will be attending. EUV is generally the star of the show and this year will be no different now that TSMC has committed to EUV production in 2019.

Last year at SPIE, TSMC presented the history of EUV development from the beginning in 1985 as … Read More

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AAPl Vs QCOM Who wins?

AAPl Vs QCOM Who wins?
by Daniel Nenni on 01-26-2017 at 7:00 am
Categories: Ceva, Foundries, Intel, IP, Mobile, TSMC

Things just got interesting in the iPhone supply chain with the $1B AAPL Vs QCOM legal action filed this week. For the life of me I could not understand why Apple second sourced the normally QCOM modem in the iPhone 7. It caused quite a stir in the technical community but we could only surmise that it was a price issue on the business side.… Read More

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DARPA Flex Logix and TSMC!

DARPA Flex Logix and TSMC!
by Daniel Nenni on 01-23-2017 at 10:00 am
Categories: eFPGA, Flex Logix, IP, TSMC

When I first saw emerging semiconductor IP company Flex Logix actively involved with TSMC I knew something big was coming and boy was I right. DARPA announced today that an agreement is in place with Flex Logix to develop EFLX eFPGA technology on TSMC 16FFC for use by companies or Government agencies designing chips for the US Government.… Read More