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TSMC Banner 2023
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Highlights of the TSMC Technology Symposium – Part 3

Highlights of the TSMC Technology Symposium – Part 3
by Tom Dillinger on 09-09-2020 at 8:00 am

CoWoS features

Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time.  This article is the last of three that attempts to summarize the highlights of the presentations.  This article focuses on the technology design enablement roadmap, as described by Cliff Hou, SVP, R&D.

Key TakeawaysRead More


Dolphin Design – Delivering High-Performance Audio Processing with TSMC’s 22ULL Process

Dolphin Design – Delivering High-Performance Audio Processing with TSMC’s 22ULL Process
by Mike Gianfagna on 09-07-2020 at 10:00 am

Dolphin Design – Delivering High Performance Audio Processing with TSMCs 22ULL Process

TSMC held their very popular Open Innovation Platform event (OIP) on August 25. The event was virtual of course and was packed with great presentations from TSMC’s vast ecosystem. One very interesting and relevant presentation was from Dolphin Design, discussing the delivery of high-performance audio processing using TSMC’s… Read More


Highlights of the TSMC Technology Symposium – Part 2

Highlights of the TSMC Technology Symposium – Part 2
by Tom Dillinger on 09-07-2020 at 8:00 am

3D Fabric

Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time.  This article is the second of three that attempts to summarize the highlights of the presentations.  This article focuses on the TSMC advanced packaging technology roadmap, as described by Doug Yu, VP, R&D.

KeyRead More


In-Chip Monitoring Helps Manage Data Center Power

In-Chip Monitoring Helps Manage Data Center Power
by Tom Simon on 09-07-2020 at 6:00 am

in-chip sensing

Designers spend plenty of time analyzing the effects of process, voltage and temperature. But everyone knows it’s not enough to simply stop there. Operating environments are tough and have lots of limitations, especially when it comes to power consumption and thermal issues. Thermal protection and even over-voltage protections… Read More


Highlights of the TSMC Technology Symposium – Part 1

Highlights of the TSMC Technology Symposium – Part 1
by Tom Dillinger on 09-04-2020 at 8:00 am

A72 core high density

Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time.  This article is the first of three that attempts to summarize the highlights of the presentations.

This article focuses on the TSMC process technology roadmap, as described by the following executives:

  • Y.J. Mii, SVP,
Read More

Smartphone Processor Trends and​ Process Differences down through 7nm

Smartphone Processor Trends and​ Process Differences down through 7nm
by Fred Chen on 08-30-2020 at 6:00 am

Transistor density process for Huawei and Apple

This comparison of smartphone processors from different companies and fab processes was originally going to be a post, but with the growing information content, I had to put it into an article. Here, due to information availability, Apple, Huawei, and Samsung Exynos processors will get the most coverage, but a few Qualcomm Snapdragon

Read More

Thermo-compression bonding for Large Stacked HBM Die

Thermo-compression bonding for Large Stacked HBM Die
by Tom Dillinger on 07-24-2020 at 8:00 am

HMB stack

Summary

Thermo-compression bonding is used in heterogeneous 3D packaging technology – this attach method was applied to the assembly of large (12-stack and 16-stack) high bandwidth memory (HBM) die, with significant bandwidth and power improvements over traditional microbump attach.

Introduction

The rapid growth of heterogeneous… Read More


Intel 7NM Slip Causes Reassessment of Fab Model

Intel 7NM Slip Causes Reassessment of Fab Model
by Robert Maire on 07-23-2020 at 5:00 pm

Intel vs TSMC

Waving white surrender flag as TSMC dominates-
The quarter was a success but the patient is dying-
Packaging now critical as Moore progress stumbles-
Intel reported a great quarter but weak H2 guidance-
But 7NM slip and “fab lite” talk sends shockwaves-

Intel reported a great quarter beating numbers all around with… Read More


In-Memory Computing for Low-Power Neural Network Inference

In-Memory Computing for Low-Power Neural Network Inference
by Tom Dillinger on 07-17-2020 at 10:00 am

von Neumann bottleneck

“AI is the new electricity.”, according to Andrew Ng, Professor at Stanford University.  The potential applications for machine learning classification are vast.  Yet, current ML inference techniques are limited by the high power dissipation associated with traditional architectures.  The figure below highlights the … Read More


A Compelling Application for AI in Semiconductor Manufacturing

A Compelling Application for AI in Semiconductor Manufacturing
by Tom Dillinger on 07-06-2020 at 6:00 am

AI opportunities

There have been a multitude of announcements recently relative to the incorporation of machine learning (ML) methods into EDA tool algorithms, mostly in the physical implementation flows.  For example, deterministic ML-based decision algorithms applied to cell placement and signal interconnect routing promise to expedite… Read More