Keysight webinar 800x100
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TSMC Explains the Fourth Era of Semiconductor – It’s All About Collaboration

TSMC Explains the Fourth Era of Semiconductor – It’s All About Collaboration
by Mike Gianfagna on 08-13-2021 at 6:00 am

TSMC Explains the Fourth Era of Semiconductor – Its All About Collaboration

The 32nd VLSI Design/CAD Symposium  just occurred in a virtual setting. The theme of the event this year was “ICs Powering Smart Life Innovation”. There were many excellent presentations across analog & RF, EDA & testing, digital & system, and emerging technology. There were also some excellent keynotes, and this… Read More


Mobileye’s Uncut Gem

Mobileye’s Uncut Gem
by Roger C. Lanctot on 08-02-2021 at 10:00 am

Mobileyes Uncut Gem

Last week, Mobileye released a 40-minute long unedited video of the company’s camera-only Supervision automated driving system in action on the chaotic streets of New York City. The video release was part of an announcement of an expansion of Mobileye’s testing of autonomous vehicle technology including New York City (as the… Read More


Highlights of the “Intel Accelerated” Roadmap Presentation

Highlights of the “Intel Accelerated” Roadmap Presentation
by Tom Dillinger on 07-30-2021 at 6:00 am

ribbon FETs

Introduction

Intel recently provided a detailed silicon process and advanced packaging technology roadmap presentation, entitled “Intel Accelerated”.  The roadmap timeline extended out to 2024, with discussions of Intel client, data center, and GPU product releases, and especially, the underlying technologies to be … Read More


Intel Accelerated

Intel Accelerated
by Scotten Jones on 07-27-2021 at 6:00 am

Intel Process Name Decoder

Intel presented yesterday on their plans for process technology and packaging over the next several years. This was the most detailed roadmap Intel has ever laid out. In this write up I will analyze Intel’s process announcement and how they match up with their competitors.

10nm Super Fin (SF)

10nm is now in volume production in three… Read More


Magnetic Immunity for Embedded Magnetoresistive RAM (eMRAM)

Magnetic Immunity for Embedded Magnetoresistive RAM (eMRAM)
by Tom Dillinger on 07-22-2021 at 6:00 am

coil interaction

Previous SemiWiki articles have discussed the introduction of embedded Spin-Transfer Torque Magnetoresistive RAM IP from GLOBALFOUNDRIES, as an evolution replacement for non-volatile embedded flash memory. (link, link)

Those articles described the key features of STT-MRAM technology, but didn’t delve into a key reliability… Read More


GloFo inside Intel? Foundry Foothold and Fixerupper- Good Synergies

GloFo inside Intel? Foundry Foothold and Fixerupper- Good Synergies
by Robert Maire on 07-18-2021 at 6:00 am

Intel GlobalFoundries Acquisition

Intel reportedly talking to Abu Dhabi to buy GloFo for $30B
Would jumpstart Intel Foundry but require investment & repair
Avoids IPO risk – Allows Abu Dhabi escape- NY benefits
Doesn’t impact near term shortage or market share

Reported by WSJ- Intel in talks to buy GloFo
The Wall Street Journal reported that Intel… Read More


TSMC Design Considerations for Gate-All-Around (GAA) Technology

TSMC Design Considerations for Gate-All-Around (GAA) Technology
by Tom Dillinger on 07-12-2021 at 6:00 am

mobility differences 3

The annual VLSI Symposium provides unique insights into R&D innovations in both circuits and technology.  Indeed, the papers presented are divided into two main tracks – Circuits and Technology.  In addition, the symposium offers workshops, forums, and short courses, providing a breadth of additional information.

At… Read More


Apple’s Orphan Silicon

Apple’s Orphan Silicon
by Paul Boldt on 07-11-2021 at 6:00 am

T2 die anno lr

Apple’s recent Spring Loaded Event brought us M1-based iMacs.  After the MacBook Air and 13” MacBook Pro in the fall, iMacs are the third Mac to jettison Intel processors.  With this transition Apple’s T2 chip enters End of Life status, so to speak.  The T2 is a bit of an enigma and now it does not have much time left.

We know it performs… Read More


VLSI Symposium – TSMC and Imec on Advanced Process and Devices Technology Toward 2nm

VLSI Symposium – TSMC and Imec on Advanced Process and Devices Technology Toward 2nm
by Scotten Jones on 07-02-2021 at 6:00 am

Figure 1

At the 2021 Symposium on VLSI Technology and Circuits in June a short course was held on “Advanced Process and Devices Technology Toward 2nm-CMOS and Emerging Memory”. In this article I will review the first two presentations covering leading edge logic devices. The two presentations are complementary and provide and excellent… Read More


Resist Development for High-NA EUV

Resist Development for High-NA EUV
by Tom Dillinger on 07-01-2021 at 10:00 am

EUV scaling

The successful transition to a new fabrication process from development to high volume manufacturing requires a collective, collaborative effort among process engineers, equipment manufacturers, and especially, chemical suppliers.  Of particular importance is the chemistry of the photoresist materials and their interaction… Read More