Clearly the key to success in the foundry business is partnerships. Easy to say, harder to do, here is an excellent example of one that works: GLOBALFOUNDRIES and ARM announced in August 2012 a multi-year agreement to jointly deliver optimized system-on-chip (SoC) solutions for ARM® processor designs on GLOBALFOUNDRIES’ 20-nanometer… Read More
Semiconductor Intellectual Property
ReRAM/CBRAM at the 2012 IEDM Conference
Time flies! IEDM time is coming up again (this year on the left coast) and the conference program is now on-line. Lots of interest to the ReRAM/CBRAM community. While some trends are emerging (Hafnium Oxide appears to be the material of choice) there are still plenty of other more contentious issues. ReRAM/CBRAM has reached the … Read More
Current Embedded Memory Solutions Are Inadequate for 100G Ethernet
With an estimated 7 billion connected devices, the demand for rich content, including video, games, and mobile apps is skyrocketing. Service providers around the globe are scrambling to transform their networks to satisfy the overwhelming demand for content bandwidth. Over the next few years, they will be looking to network… Read More
Toshiba’s ReRAM R&D Roadmap
Most companies in the memory business have ReRAM on their radar if not their roadmaps. Toshiba have made some bullish comments about the roadmap and chip size for ReRAM at a recent R&D Strategies Update. At face value, the schedule would put Toshiba quite a bit ahead of their competitors. Over at ReRAM-Forum.com, we have done… Read More
Hand-crafted for horsepower: Apple A6 SoC
For all the raving and ranting and hand-wringing about the iPhone 5, the centerpiece of the device – the new A6 SoC – is proving to be a marvelous piece of engineering.… Read More
Samsung going vertical Qualcomm cry CEVA laugh
These last days have been full of Apple related stories; maybe it’s time to discuss a new topic? Like for example Samsung, direct competitor for Apple in the smartphone market, and take a look at the company move toward more vertical integration. Everybody working in the SC industry knows that Samsung is ranked #2 behind Intel, even… Read More
iPhone 5: Boost to semiconductor market?
The release of Apple’s iPhone 5 has led to much speculation on its impact on the economy. An analyst at J.P. Morgan estimated the iPhone 5 could add $3.2 billion to U.S. GDP in the fourth quarter, adding ¼ to ½ point to the GDP growth rate.
Analysts’ estimates for total iPhone sales in 4Q 2012 are in the range of 46 million to 50 million units.… Read More
CEVA DSP Technology Symposium Series 2012
You are cordially invited to register to attend the CEVA DSP Technology Symposium Series 2012, which will take place in Taiwan, October 16th, China, October 18th and Israel, November 1st.
CEVA’s industry-leading experts and engineers will present a full day of lectures and seminars where you will learn about the latest technological… Read More
SAME 2012 Conference on October 2-3 in Sophia is coming soon!
This is the 15[SUP]th[/SUP] anniversary for the SAME Conference, dedicated to innovation on Microelectronics. Sophia-Antipolis is not only close to Mediterranean sea, but also at the heart of Telecom valley in south of France, with Texas Instruments design center dedicated to Application Processor design (OMAP), Cadence… Read More
Virtual Prototype your SoC including Arteris FlexNoC and optimize architecture using CPAK from Carbon
I have talked about Virtual Prototyping a SoC including FlexNoC Network on Chip IP from Arteris by using Carbon Design Systems set of tools in a previous post. A blog, posted on Carbon’ web, is clearly explaining the process to follow to optimize a fabric (FlexNoC) successively using the different tools from Carbon. Bill Neifert,… Read More
Selling the Forges of the Future: U.S. Report Exposes China’s Reliance on Western Chip Tools