BroncoAI DVCon100x800 FIX
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Custom SoC Platform Solutions for AI Applications at the TSMC OIP

Custom SoC Platform Solutions for AI Applications at the TSMC OIP
by Daniel Nenni on 09-27-2018 at 12:00 pm

The TSMC OIP event is next week and again it is packed with a wide range of technical presentations from TSMC, top semiconductor, EDA, and IP companies, plus long time TSMC partner and ASIC provider Open-Silicon, a SiFive Company. You can see the full agenda HERE.

AI is revolutionizing and transforming virtually every industry… Read More


DesignWare IP as AI Building Blocks

DesignWare IP as AI Building Blocks
by Alex Tan on 09-11-2018 at 7:00 am

AI is disruptive and transformative to many status quos. Its manifestation can be increasingly seen in many business transactions and various aspects of our lives. While machine learning (ML) and deep learning (DL) have acted as its catalysts on the software side, GPU and now ML/DL accelerators are spawning across the hardware… Read More


GLOBALFOUNDRIES Pivoting away from Bleeding Edge Technologies

GLOBALFOUNDRIES Pivoting away from Bleeding Edge Technologies
by Daniel Nenni on 08-27-2018 at 3:00 pm

It’s no secret that I have been a big fan of GLOBALFOUNDRIES since they came about in March of 2009. We even included them in our first book “Fabless: The Transformation of the Semiconductor Industry” right next to TSMC. I am also a big fan of pivoting which is the term we use here in Silicon Valley to describe some of the most innovative… Read More


TSMC GlobalFoundries and Samsung Updates from 55DAC

TSMC GlobalFoundries and Samsung Updates from 55DAC
by Daniel Nenni on 08-20-2018 at 7:00 am

One of my favorite traditions at the Design Automation Conference is the Synopsys foundry events (the videos are now available). I learned a long time ago that the foundries are the foundation of the fabless semiconductor ecosystem and your relationships with the foundries can make or break you, absolutely. I also appreciate … Read More


Measuring Up 7nm IP

Measuring Up 7nm IP
by Daniel Nenni on 08-17-2018 at 12:00 pm

The Linley Group is an industry-leading source for independent technology analysis of semiconductors for networking, communications, mobile, and data-center applications. Their Microprocessor Report is widely read as a source of un-biased, no-nonsense analysis of technologies and trends. So, when they dig into something… Read More


A True Signoff for 7nm and Beyond

A True Signoff for 7nm and Beyond
by Alex Tan on 08-13-2018 at 12:00 pm

The Tale of Three Metrics
Meeting PPA (Performance, Power and Area) target is key to a successful design tapeout. These mainstream QoR (Quality of Results) metrics are rather empirical yet inter-correlated and have been expanded to be linked with other metrics such as yield, cost and reliability. While the recent CPU performance… Read More


Optimization and Reliability for FinFET designs at #55DAC

Optimization and Reliability for FinFET designs at #55DAC
by Daniel Payne on 07-25-2018 at 7:00 am

TSMC is the leading foundry worldwide and they make a big splash each year at the DAC exhibit and conference, so I stopped by their theatre area during the presentation from IP vendor Moortec to see what’s new this year. Stephen Crosher was the presenter from Moortec and we had exchanged emails before, so this was the first time… Read More


Keeping Pace With 5nm Heartbeat

Keeping Pace With 5nm Heartbeat
by Alex Tan on 07-23-2018 at 12:00 pm

A Phase-Locked Loop (PLL) gives design a heartbeat. Despite its minute footprint, it has many purposes such as being part of the clock generation circuits, on-chip digital temperature sensor, process control monitoring in the scribe-line or as baseline circuitry to facilitate an effective measurement of the design’s power… Read More


FDSOI Status and Roadmap

FDSOI Status and Roadmap
by Scotten Jones on 07-23-2018 at 7:00 am

FDSOI is gaining traction in the market place. At their foundry forum in May, Samsung announced they have 17 FDSOI products in high volume manufacturing (you can read Tom Dilliger’s write up of the Samsung Foundry Forum here). At SEMICON West in July, GLOBALFOUNDRIES (GF) announced FDSOI design wins worth $2 billion dollars in … Read More


Integrity, Reliability Shift Left with ICC

Integrity, Reliability Shift Left with ICC
by Bernard Murphy on 06-26-2018 at 7:00 am

There is a nice serendipity in discovering that two companies I cover are working together. Good for them naturally but makes my job easier because I already have a good idea about the benefits of the partnership. Synopsys and ANSYS announced a collaboration at DAC 2017 for accelerating design optimization for HPS, mobile and automotive.… Read More