Create a panel discussion about analog IC design and reliability and my curiosity is instantly piqued, so I attended a luncheon discussion at #55DAC moderated by Steven Lewis of Cadence. The panelists were quite deep in their specialized fields:… Read More
SEMICON West – Leading Edge Lithography and EUV
At SEMICON West I attended the imec technology forum, multiple Tech Spot presentations and conducted a number of interviews relevant to advanced lithography and EUV. In this article I will summarize what I learned plus make some comments on the outlook for EUV.… Read More
Netspeed and NSITEXE talk about automotive design trends at 55DAC
DAC is where both sides of the design equation come together for discussion and learning. This is what makes attending DAC discussion panels so interesting; you are going to hear from providers of tools, methodologies and IP as well as those who need to use them to deliver working solutions. There are few places where the interplay… Read More
Daniel’s #55DAC Trip Report
Another year, another DAC, and last month it was #55DAC in SFO and the first thing that I noticed was that the event was no longer located in the traditional North or South Halls, rather we were in the smaller, Moscone West on two floors, almost like a 3D FinFET. Checkin to get my badge was highly automated and oh so fast, well done.… Read More
1-on-1 with Anirudh Devgan, President, Cadence
At the Design Automation Conference, no one is busier than an EDA company executive — conference panels, product launch briefings, customer meetings, and corporate dinners all place considerable demands on their time. I was fortunate enough to be able to meet with Anirudh Devgan, President of Cadence, at the recent DAC55 in San… Read More
Optimization and Reliability for FinFET designs at #55DAC
TSMC is the leading foundry worldwide and they make a big splash each year at the DAC exhibit and conference, so I stopped by their theatre area during the presentation from IP vendor Moortec to see what’s new this year. Stephen Crosher was the presenter from Moortec and we had exchanged emails before, so this was the first time… Read More
Automotive is setting the goalposts for next generation designs
Automotive applications are having a tremendous influence on semiconductor design. This influence is coming from innovations in cloud computing, artificial intelligence, communications, sensors that all serve the requirements of the automotive market. It should come as no surprise that ADAS and autonomous driving are … Read More
FDSOI Status and Roadmap
FDSOI is gaining traction in the market place. At their foundry forum in May, Samsung announced they have 17 FDSOI products in high volume manufacturing (you can read Tom Dilliger’s write up of the Samsung Foundry Forum here). At SEMICON West in July, GLOBALFOUNDRIES (GF) announced FDSOI design wins worth $2 billion dollars in … Read More
SEMICON West – Soitec is becoming a key enabler
A variety of growing and emerging segments of the semiconductor industry rely on Silicon-On-Insulator (SOI) wafers. Soitec is the primary source for SOI wafers particularly on 300mm. On Tuesday at SEMICON I got to sit down with Bernard Aspar, Soitec’s Executive Vice President, Communication & Power BU and Christophe… Read More
Maximize Bandwidth in your Massively Parallel AI SoCs?
Artificial Intelligence is one of the most talked about topics on the conference circuit this year and I don’t expect that to change anytime soon. AI is also one of the trending topics on SemiWiki with organic search bringing us a wealth of new viewers. You may also have noticed that AI is a hot topic for webinars like the one I am writing… Read More
Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet