Steven Woo, Fellow and Distinguished Inventor presented at the just concluded Linley Spring Processor Conference a talk about AI in the Era of Connectivity. As he put it, the world is becoming increasingly connected, with a marked surge of digital data, causing a dependence on said data. With the explosion of digital data and AI,… Read More
IC Implementation Improved by Hyperconvergence of Tools
Physical IC design is a time consuming and error prone process that begs for automation in the form of clever EDA tools that understand the inter-relationships between logic synthesis, IC layout, test and sign-off analysis. There’s even an annual conference called ISPD – International Symposium on Physical Design… Read More
Customizing and Standardizing IP with eSilicon at the Linley Conference
During the SoC Design Session at the just concluded Linley Spring Processor Conference in Santa Clara, Carlos Macian, Senior Director AI Strategy and Products at eSilicon, held a talk entitled ‘Opposites Attract: Customizing and Standardizing IP Platforms for ASIC Differentiation’.
Standardization is key to IP in modern … Read More
User2User Silicon Valley 2019
This will be one of the more interesting Mentor User Group Meetings now that the Siemens acquisition has fully taken effect and the new management team is in place. The Mentor User Conference is at the Santa Clara Marriott, Santa Clara, California on May 2, 2019 from 9:00 am to 6:00pm.
Remember, in 2017 Siemens acquired Mentor Graphics… Read More
SPIE Advanced Lithography Conference – Imec and Veeco on EUV
At the SPIE Advanced Lithography Conference Imec presented several papers on EUV and Veeco presented about etching for EUV masks. I had the opportunity to see the presentations and speak with some of the authors. In this article I will summarize the key issues around EUV based on this research.
EUV is ramping up into high volume 7nm… Read More
TSMC Q1 2019 Earnings Call Discussion!
It’s no coincidence that the TSMC Symposium is right after the Q1 earnings call. This will allow TSMC to talk more freely and they certainly will, my opinion. It is a very interesting time in the semiconductor industry and TSMC, being the bellwether, can tell us what will happen the rest of the year and give us some 2020 insights.… Read More
Flex Logix InferX X1 Optimizes Edge Inference at Linley Processor Conference
Dr. Cheng Wang, Co-Founder and SVP Engineering at Flex Logix, presented the second talk in the ‘AI at the Edge’ session, at the just concluded Linley Spring Processor Conference, highlighting the InferX X1 Inference Co-Processor’s high throughout, low cost, and low power. He opened by pointing out that existing inference solutions… Read More
TechInsights Gives Memory Update at IEDM18 DRAM and Emerging Memories
On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees.
This is the second part of the review of Jeongdong’s talk, we covered NAND flash technology in the last post. Jeongdong is a Senior Technical… Read More
TechInsights Gives Memory Update at IEDM18 NAND Flash
On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees. Arabinda was first up, giving a talk on the “10-year Journey of Apple’s iPhone and Innovations in Semiconductor Technology”, followed by Jeongdong… Read More
Real Time Object Recognition for Automotive Applications
The basic principles used for neural networks have been understood for decades, what have changed to make them so successful in recent years are increased processing power, storage and training data. Layered on top of this is continued improvement in algorithms, often enabled by dramatic hardware performance improvements.… Read More


A Century of Miracles: From the FET’s Inception to the Horizons Ahead