As chip complexity grows, so does the need for a well-thought-out design data management strategy. This is a hot area, and Cliosoft is in the middle of it. When I was at eSilicon, we used Cliosoft technology to manage the design and layout of high-performance analog designs across widely separated design teams. The tool worked… Read More
SystemC Methodology for Virtual Prototype at DVCon USA
DVCon was the first EDA conference in our industry impacted by the pandemic and travel restrictions in March of this year, and the organizers did a superb job of adjusting the schedule. I was able to review a DVCon tutorial called “Defining a SystemC Methodology for your Company“, given by Swaminathan Ramachandran… Read More
A Tour of This Year’s DAC IP Track with Randy Fish
DAC is a complex event with many “moving parts”. While the conference has gone virtual this year (as all events have), the depth of the event remains the same. The technical program has always been of top quality, with peer-reviewed papers presented across many topics and across the world. This is also the oldest part of DAC, dating… Read More
Contact over Active Gate Process Requirements for 5G
Summary
A recent process enhancement in advanced nodes is to support the fabrication of contacts directly on the active gate area of a device. At the recent VLSI 2020 Symposium, the critical advantages of this capability were highlighted, specifically in the context of the behavior of RF CMOS devices needed for 5G designs.
Introduction… Read More
Optimizing Chiplet-to-Chiplet Communications
Summary
The growing significance of ultra-short reach (USR) interfaces on 2.5D packaging technology has led to a variety of electrical definitions and circuit implementations. TSMC recently presented the approach adopted by their IP development team, for a parallel-bus, clock-forwarded USR interface to optimize power/performance/area… Read More
Multi-Vt Device Offerings for Advanced Process Nodes
Summary
As a result of extensive focus on the development of workfunction metal (WFM) deposition, lithography, and removal, both FinFET and gate-all-around (GAA) devices will offer a wide range of Vt levels for advanced process nodes below 7nm.
Introduction
Cell library and IP designers rely on the availability of nFET and pFET… Read More
Key Semiconductor Conferences go Virtual
This last week the 2020 Symposia on VLSI Technology and Circuits (VLSI Conference) was held as a virtual conference for the first time and it was announced today (June 24th) that this year’s IEDM conference will also be held as a virtual conference.
“The IEDM Executive Committee has decided that in the interest of prioritizing the… Read More
Design Technology Co-Optimization (DTCO) for sub-5nm Process Nodes
Summary
Design Technology Co-Optimization (DTCO) analysis was pursued for library cell PPA estimates for gate-all-around (GAA) devices and new metallurgy options. The cell design and process recommendations are a bit surprising.
Introduction
During the “golden years” of silicon technology evolution that applied Dennard… Read More
Seeing is Believing, the Benefits of Delta’s Low-Resolution Vision Chip
Presto Engineering recently held a webinar discussing vision chip technology – what a vision chip is, what are the applications and how can you optimize its use. Samer Ismail, a design engineer at Presto Engineering with deep domain expertise in vision chip technology was the presenter. Samer takes you on a very informative … Read More
Embedded MRAM for High-Performance Applications
Summary
A novel spin-transfer torque magnetoresistive memory (STT-MRAM) IP offering provides an attractive alternative for demanding high-performance embedded applications.
Introduction
There is a strong need for embedded non-volatile memory IP across a wide range of applications, as depicted in the figure below.
The… Read More


Silicon Insurance: Why eFPGA is Cheaper Than a Respin — and Why It Matters in the Intel 18A Era