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After spending a significant amount of my career in the IP library business it was an easy transition to Solido Design. I spent 10+ years traveling the world with CEO Amit Gupta working with the foundries and their top customers. In fact, the top 40 semiconductor companies use Solido. IP companies are also big Solido users including… Read More
FPGAs are a popular method to implement hardware accelerators for applications such as AI/ML, SmartNICs and storage acceleration. PCIe Gen5 is a high bandwidth communication protocol that is a key enabler for this class of applications. Putting all this together presents significant demands on the FPGA for performance and … Read More
Looking at a typical SoC design today it’s likely to contain a massive amount of memory IP, like: RAM, ROM, register files. Keeping memory close to the CPU makes sense for the lowest latency and highest performance metrics, but what about process variations affecting the memory operation? At the recent DAC conference held… Read More
Similar to my last post on the HCL DevOps webinar series, I will cover their presentation of HCL Compass in a webinar that was recorded on July 29 about how HCL Compass delivers defect tracking and more.
This webinar was presented by Steve Boone, head of product management at HCL Software DevOps, Howie Bernstein, product manager… Read More
The ARC Processor has a rich history. Originally named the Argonaut RISC Processor, it was designed for the Nintendo Game Systems in the 1990s. Argonaut Technologies Limited later became ARC International. My first intimate exposure to ARC was in 2009 when Virage Logic acquired ARC. A year later Virage was acquired by Synopsys… Read More
As software content increases in system-on-chip and system-in-package designs, emulation has become a critical enabling technology for the software team. This technology offers software developers the opportunity to verify their code in against a high-fidelity model of the target system that actually executes fast enough… Read More
At SEMICON West, Applied Materials announced a new selective gap fill tool to address the growing resistance issues in interconnect at small dimensions. I had the opportunity to discuss this new tool and the applications for it with Zhebo Chen global product manager in the Metal Deposition Products group at Applied Materials.… Read More
Summary
At the recent Intel Architecture Day 2020 symposium, a number of technology enhancements to the Intel 10nm process node were introduced. The cumulative effect of these enhancements would provide designs with a performance boost (at iso-power) approaching 20% – a significant intra-node enhancement, to be sure. The… Read More
HCL is an interesting organization. You may know them as an Indian company that provides software and hardware services. At about $10B US and over 110,000 employees working around the world, they are indeed a force in the industry. They’ve also created a software company called HCL Software that develops tools and technologies… Read More
One of the Designer Track at this year’s DAC focused on the popular topic of automotive electronics. The title was particularly on-point, The Modern Automobile: A Safety and Security “Hot Zone”. The session was chaired by Debdeep Mukhopadhyay, a Professor at the Indian Institute of Technology in Kharagpur.
This special, invited… Read More
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