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Your IP Portfolio is Probably Leaking. What Can You Do About It?

Your IP Portfolio is Probably Leaking. What Can You Do About It?
by Mike Gianfagna on 05-13-2021 at 2:00 pm

Your IP Portfolio is Probably Leaking What Can You Do About It

This topic is inspired by a presentation at last year’s DAC presented by Methodics, now part of Perforce. The issues raised by the original presentation are still quite relevant in the current business climate. IP leakage is something everyone should consider as part of their normal business operations. Your design IP really … Read More


Webinar: System Level Modeling and Analysis of Processors and SoC Designs

Webinar: System Level Modeling and Analysis of Processors and SoC Designs
by Daniel Payne on 05-10-2021 at 10:00 am

exploration flow min

Engineers love to optimize their designs, but that implies that there are models and stimulus to automate the process.  Process engineers have TCAD tools, circuit designers have SPICE for circuit simulation, logic designers have gate-level simulators, RTL designers use logic simulation, but what is there for the system architects… Read More


Samtec Keynote – Power Integrity is the New Black Magic

Samtec Keynote – Power Integrity is the New Black Magic
by Mike Gianfagna on 05-10-2021 at 6:00 am

Samtec Keynote – Power Integrity is the New Black Magic

The Signal Integrity Journal recently held a half day Electronic Systems SI/PI Forum that included presentations from industry leaders covering key design topics for signal integrity and power integrity engineers. The event was sponsored by Cadence. The keynote for the event was presented by Istvan Novak, principal signal… Read More


Adaptive Power/Performance Management for FD-SOI

Adaptive Power/Performance Management for FD-SOI
by Tom Dillinger on 04-21-2021 at 10:00 am

Dolphin FD SOI FBB

A vexing chip design issue is how to achieve (or improve) performance and power dissipation targets, allowing for a wide range of manufacturing process variation (P) and dynamic operation voltage and temperature fluctuations (VT).  One design method is to analyze the operation across a set of PVT corners, and ensure sufficient… Read More


Die-to-Die Interface PHY and Controller Subsystem for Next Generation Chiplets

Die-to-Die Interface PHY and Controller Subsystem for Next Generation Chiplets
by Kalar Rajendiran on 04-19-2021 at 10:00 am

Comparison of D2D PHY and XSR SerDes OpenFive

In early April, Gabriele Saucier kicked off Design & Reuse’s IPSoC Silicon Valley 2021 Conference. IPSoC conference as the name suggests is dedicated to semiconductor intellectual property (IP) and IP-based electronic systems. There were a number of excellent presentations at the conference. The presentations had been… Read More


TSMC Ups CAPEX Again!

TSMC Ups CAPEX Again!
by Daniel Nenni on 04-16-2021 at 6:00 am

TSMC 1Q21 Revenue by Platform

We were all pleasantly surprised when TSMC increased 2021 Capex to a record $28 billion. To me this validated the talk inside the ecosystem that Intel would be coming to TSMC at 3nm. We were again surprised when TSMC announced a $100B investment over the next three years which belittled Intel’s announcement that they would spend … Read More


Enabling Next Generation Silicon In Package Products

Enabling Next Generation Silicon In Package Products
by Kalar Rajendiran on 04-15-2021 at 10:00 am

System on Package Motivation AlphaWave IP

In early April, Gabriele Saucier kicked off Design & Reuse’s IPSoC Silicon Valley 2021 Conference. IPSoC conference as the name suggests is dedicated to semiconductor intellectual property (IP) and IP-based electronic systems. There were a number of excellent presentations at the conference. The presentations had been… Read More


SPIE 2021 – Applied Materials – DRAM Scaling

SPIE 2021 – Applied Materials – DRAM Scaling
by Scotten Jones on 04-08-2021 at 10:00 am

Slide1

At the SPIE Advanced Lithography Conference in February 2021, Regina Freed of Applied Materials gave a paper: “Module-Level Material Engineering for Continued DRAM Scaling”. Applied Materials provided me with the presentation and was kind enough to set up an interview for me with Regina Freed.

I also spoke to Regina Freed last… Read More


Webinar: Annapurna Labs and Altair Team up for Rapid Chip Design in the Cloud

Webinar: Annapurna Labs and Altair Team up for Rapid Chip Design in the Cloud
by Mike Gianfagna on 04-07-2021 at 6:00 am

Annapurna Labs and Altair Team up for Rapid Chip Design in the Cloud

This is a story of strategic recursion. Yes, a fancy term. I just made up. If you’re not into algorithm development you can Google recursion, but the simple explanation is we’re talking about using the cloud to design the cloud. The story begins with Annapurna Labs, a fabless chip company focused on bringing innovation to cloud infrastructure,… Read More


AUGER, the First User Group Meeting for Agnisys

AUGER, the First User Group Meeting for Agnisys
by Daniel Nenni on 04-01-2021 at 10:00 am

website banner with date 1

As a long-time member of the EDA community, I really believe in user groups. EDA tools are complicated beasts, with many options and different ways to use them, and they are constantly evolving. Users interact with their local field applications engineers (FAEs) and sometimes corporate AEs (product specialists) as well on a regular… Read More