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The next transition from current FinFET devices at advanced process nodes is the “nanosheet” device, as depicted in the figure below. [1]
The FinFET provides improved gate-to-channel electrostatic control compared to a planar device, where the gate traverses three sides of the fin. The “gate-all-around” characteristics… Read More
The device roadmap for the next few advanced process nodes seems relatively clear. The FinFET topology will subsequently be displaced by a “gate-all-around” device, typically using multiple stacked channels with a metal gate completely surrounding the “nanosheets”. Whereas the fin demonstrates improved gate-to-channel… Read More
As 2020 comes to a close, I hear a lot of chatter about virtual meeting fatigue; “I’m Zoomed out”. We’ve all attended virtual versions of conferences this year with various degrees of success. Overall, I have to say these events are getting better. Semiconductor and EDA folks have a way of adapting and inventing, and it’s showing … Read More
It is quite amazing that silicon-based devices have been the foundation of our industry for over 60 years, as it was clear that the initial germanium-based devices would be difficult to integrate at a larger scale. (GaAs devices have also developed a unique microelectronics market segment.) More recently, it is also rather … Read More
The Cadence Virtuoso Design System has been one of the premier Integrated Circuit design systems for many years and is used by most major semiconductor companies. While it is powerful and versatile, it is often not optimized for certain complex, repetitive and time-consuming layout design tasks.
The founder and president … Read More
A few weeks ago I wrote about an upcoming event Silicon Catalyst was hosting, the Semiconductor Industry Forum – A View to the Future. I mentioned a high-profile group of presenters: Don Clark, Contributing Journalist, New York Times as moderator; Mark Edelstone, Chairman of Global Semiconductor Investment Banking, Morgan… Read More
The vast majority of the attention given to the introduction of each new advanced process node focuses on lithographic updates. The common metrics quoted are the transistors per mm**2 or the (high-density) SRAM bit cell area. Alternatively, detailed decomposition analysis may be applied using transmission electron microscopy… Read More
Alphawave IP is a new member of the SemiWiki community. You can learn about the company and their CEO, Tony Pialis in this interview by Dan Nenni. Design & Reuse did a virtual IP-SOC Conference recently and Tony presented. The D&R event had a very strong lineup of presenters. They supplemented the prepared video presentations… Read More
The introduction of heterogeneous 3DIC packaging technology offers the opportunity for significant increases in circuit density and performance, with corresponding reductions in package footprint. Yet, the implementation of a complex 3DIC product requires a considerable investment in methodology development for all… Read More
As I have discussed before, I believe that IEDM is the premier technical conference for understanding leading edge process technologies. Beginning this coming weekend, this year’s edition of IEDM will be held virtually, and I highly recommend attending.
The conference held a press briefing last Monday. The tutorial and short… Read More
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