SILVACO 073125 Webinar 800x100
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CES 2022 and the Electrification of Cycling

CES 2022 and the Electrification of Cycling
by Daniel Payne on 01-05-2022 at 10:00 am

bosch min

With the Omicron variant of the COVID-19 virus in the news, there have been some big corporate names withdrawing from CES ( Peleton, Super73), however the cycling innovation companies assembled once again in Las Vegas this year for CES 2022. Data from statista show the strong growth in bicycle revenues in March 2020, when the pandemic… Read More


Self-Aligned Via Process Development for Beyond the 3nm Node

Self-Aligned Via Process Development for Beyond the 3nm Node
by Tom Dillinger on 01-05-2022 at 6:00 am

TEM DoD

The further scaling of interconnect and via lithography for advanced nodes is challenged by the requirement to provide a process window that supports post-patterning critical dimension variations and mask overlay tolerances.  At the recent international Electron Devices Meeting (IEDM) in San Francisco, TSMC presented … Read More


Technology Design Co-Optimization for STT-MRAM

Technology Design Co-Optimization for STT-MRAM
by Tom Dillinger on 01-04-2022 at 6:00 am

sense amplifier

Previous SemiWiki articles have described the evolution of embedded non-volatile memory (eNVM) IP from (charge-based) eFlash technology to alternative (resistive) bitcell devices.  (link, link)

The applications for eNVM are vast, and growing.  For example, microcontrollers (MCUs) integrate non-volatile memory for … Read More


Demand for High Speed Drives 200G Modulation Standards

Demand for High Speed Drives 200G Modulation Standards
by Tom Simon on 01-03-2022 at 10:00 am

200G Modulation

Right now, the most prevalent generation of Ethernet for data centers is 400 Gbps, with the shift to 800 Gbps coming rapidly. It is expected that by 2025 there will be 25 million units of 800 Gbps shipped. Line speeds of 100G are used predominantly for 400 Gbps Ethernet – requiring 4 lanes each. Initially 800 Gbps will simply … Read More


Advanced 2.5D/3D Packaging Roadmap

Advanced 2.5D/3D Packaging Roadmap
by Tom Dillinger on 01-03-2022 at 6:00 am

SoIC futures

Frequent SemiWiki readers are no doubt familiar with the advances in packaging technology introduced over the past decade.  At the recent International Electron Devices Meeting (IEDM) in San Francisco, TSMC gave an insightful presentation sharing their vision for packaging roadmap goals and challenges, to address the growing… Read More


Webinar: AMS, RF and Digital Full Custom IC Designs need Circuit Sizing

Webinar: AMS, RF and Digital Full Custom IC Designs need Circuit Sizing
by Daniel Payne on 01-02-2022 at 10:00 am

circuit sizing min

My career started out by designing DRAM circuits at Intel, and we manually sized every transistor in the entire design to get the optimum performance, power and area. Yes, it was time consuming, required lots of SPICE iterations and was a bit error prone. Thank goodness times have changed, and circuit designers can work smarter … Read More


DAC 2021 – Cliosoft Overview

DAC 2021 – Cliosoft Overview
by Daniel Payne on 12-30-2021 at 6:00 am

Simon and Karim min

It’s been awhile since I really looked at what Cliosoft has to offer in the EDA tool space, so at the 58th DAC I stopped by their exhibit booth on Tuesday to visit with Karim Khalfan, VP of Application Engineering, and Simon Rance, VP of Marketing. Their booth had all of the hot market segments listed: Automotive, 5G, IoT, AI, … Read More


Methodology for Aging-Aware Static Timing Analysis

Methodology for Aging-Aware Static Timing Analysis
by Tom Dillinger on 12-28-2021 at 10:00 am

char STA flow

At the recent Design Automation Conference, Cadence presented their methodology for incorporating performance degradation measures due to device aging into a static timing analysis flow. [1] (The work was a collaborative project with Samsung Electronics.)  This article reviews the highlights of their presentation.

BackgroundRead More


DAC 2021 – Taming Process Variability in Semiconductor IP

DAC 2021 – Taming Process Variability in Semiconductor IP
by Daniel Payne on 12-27-2021 at 10:00 am

process node variability min

Tuesday at DAC was actually my very first time attending a technical session, and the presentation from Nebabie Kebebew, Siemens EDA, was called, Mitigating Variability Challenges of IPs for Robust Designs. There were three presentations scheduled for that particular Designer, IP and Embedded Systems track, but with the COVID… Read More


5 Talks on RISC-V

5 Talks on RISC-V
by Milos Tomic on 12-27-2021 at 6:00 am

Milos Tomic

Veriest recently hosted a webinar focusing on RISC-V as a forerunner of ongoing open-source revolution in chip design. Speakers were distinguished professionals from industry and academia. Webinar covered topics from market trends to open-source hardware initiatives, tools and methodologies.

Zvonimir Bandić: RISC-V Read More