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Events
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DesignCon 2023 Panel Photonics future: the vision, the challenge, and the path to infinity & beyond!

DesignCon 2023 Panel Photonics future: the vision, the challenge, and the path to infinity & beyond!
by Raha Vafaei on 02-28-2023 at 6:00 am
Categories: Ansys, Inc., EDA, Events

Image 1 1

The explosion in volume and consumption of data, fueled by industry trends in virtualization, networking, and computing among others, continues to push photonic solutions forward into leading positions. On Feb 2nd, I attended a panel by Ansys at DesignCon that brought together industry experts from Intel, GlobalFoundries,… Read More

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Webinar: The Data Revolution of Semiconductor Production

Webinar: The Data Revolution of Semiconductor Production
by Daniel Nenni on 02-27-2023 at 6:00 am
Categories: Analytics, Events, proteanTecs

ProteanTecs Webinar

How Advancements in Technology Unlock New Insights

The demand for efficient and scalable chip production has never been greater. The need to scale at volume and adapt to shorter innovation cycles makes machine learning and advanced data analytics essential components of semiconductor production.

Join us on Tuesday, March … Read More

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Exponential Innovation: HFSS

Exponential Innovation: HFSS
by Matt Commens on 02-21-2023 at 10:00 am
Categories: Ansys, Inc., EDA, Events

evolution of hfss simulation capacity

The old adage: “If it ain’t broke, don’t fix it,” is as offensive to innovators as it is to grammarians. Just because something works well, doesn’t mean it cannot work better. As times change and technology advances, you either move forward or get left behind.

If you haven’t upgraded to the latest Ansys HFSS electromagnetic simulation… Read More

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AMAT- Flat is better than down-Trailing tool strength offsets memory- backlog up

AMAT- Flat is better than down-Trailing tool strength offsets memory- backlog up
by Robert Maire on 02-20-2023 at 10:00 am
Categories: Events, Semiconductor Advisors, Semiconductor Services

AMAT CVD 3

-Strength in trailing tools offsets weak memory resulting in flat
-Order book very volatile but backlog surprisingly still grew
-Trailing edge VS Leading edge = 50/50 – Foundry/logic over 2/3
-Not nearly as bad as Lam but not as good as ASML

AMAT posts good quarter & guide – Flat for three quarters

Applied Materials… Read More

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IEDM 2023 – 2D Materials – Intel and TSMC

IEDM 2023 – 2D Materials – Intel and TSMC
by Scotten Jones on 02-20-2023 at 6:00 am
Categories: Events, Semiconductor Services, TechInsights
6 Comments

Slide1

Intel and TSMC make up two of the three leading edge logic companies. At IEDM held in December 2022, Intel presented a paper on 2D Materials and TSMC presented 6 papers. Clearly 2D materials are of great interest at least to two of the three leading edge logic companies. Before diving into the papers, some background context is needed.… Read More

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Speeding up Chiplet-Based Design Through Hardware Emulation

Speeding up Chiplet-Based Design Through Hardware Emulation
by Kalar Rajendiran on 02-16-2023 at 10:00 am
Categories: Chiplet, Corigine, EDA, Emulation, Events, Prototyping

Barriers on the Continuum to SiP

The first chiplets focused summit took place last month. So many accomplished speakers gave keynote talks on what direction should and would the Chiplets ecosystem evolution take. Corigine presented the keynote on what direction hardware emulation should and would evolve for speeding up chiplet- based designs. During a pre-conference… Read More

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Optimization Tradeoffs in Power and Latency for PCIe/CXL in Datacenters

Optimization Tradeoffs in Power and Latency for PCIe/CXL in Datacenters
by Daniel Nenni on 02-13-2023 at 10:00 am
Categories: Events, IP, Synopsys

Power Latency Webinar min

PCI Express Power Bottleneck

Madhumita Sanyal, Sr. Technical Product Manager, and Gary Ruggles, Sr. Product Manager, discussed the tradeoffs between power and latency in PCIe/CXL data centers during a live SemiWiki webinar on January 26, 2023. The demands on PCIe continue to grow with the integration of multiple components… Read More

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Alphawave Semi at the Chiplet Summit

Alphawave Semi at the Chiplet Summit
by Daniel Nenni on 02-03-2023 at 6:00 am
Categories: Alphawave Semi, Chiplet, Events, IP

Alphawave Semi Chiplet Summit

The first annual Chiplet Summit was held last week in San Jose and I must say it exceeded my expectations, but I have some advice for the participating speakers and sponsoring companies. A good portion of the content was on WHY chiplets and not HOW. I think we have progressed passed this point and if we keep dwelling on it we will delay… Read More

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Lam chops guidance, outlook, headcount- an ugly, long downturn- memory plunges

Lam chops guidance, outlook, headcount- an ugly, long downturn- memory plunges
by Robert Maire on 01-31-2023 at 2:00 pm
Categories: Events, Semiconductor Advisors, Semiconductor Services
1 Comment

Lamb chops

-Lam Research chops guidance, outlook & headcount sharply
-Further declines as 2023 will be H1 weighted- No end in sight
-System sales cut by more than half as even service is cut
-Memory is the culprit as expected-Forcing business “reset”

A sad sounding conference call….

While Lam reported a good December,… Read More

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ASML – Powering through weakness – Almost untouchable – Lead times exceed downturn

ASML – Powering through weakness – Almost untouchable – Lead times exceed downturn
by Robert Maire on 01-26-2023 at 10:00 am
Categories: Events, Lithography, Semiconductor Advisors, Semiconductor Services
5 Comments

Robert Maire Bloomberg

-Demand far exceeds supply & much longer than any downturn
-Full speed ahead-$40B in solid backlog provides great comfort
-ASP increase shows strength- China is non issue
-In a completely different league than other equipment makers

Reports a good beat & Guide

Revenues were Euro6.4B with system sales making up Euro4.7B… Read More