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Cadence Execs Look to the Future

Cadence Execs Look to the Future
by Dave Bursky on 07-01-2022 at 6:00 am

CDNLive 2020

Everything is becoming digital, and everything digital requires semiconductors. Cadence’s President and CEO, Dr. Anirudh Devgan, highlighted this at the recent CadenceLIVE user conference and discussed many of the company’s accomplishments and future directions. Dr. Devgan also sees the emergence of data—especially … Read More


Imec Buried Power Rail and Backside Power Delivery at VLSI

Imec Buried Power Rail and Backside Power Delivery at VLSI
by Scotten Jones on 06-28-2022 at 6:00 am

Imec BPR Page 06

At the VLSI Technology Symposium Imec presented on Buried Power Rails (BPR) and Backside Power Delivery (BSPD) in a paper entitled: “Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails”. I recently had a chance to interview one of the authors, Naoto Horiguchi about the work. I have interviewed … Read More


TSMC 2022 Technology Symposium Review – Advanced Packaging Development

TSMC 2022 Technology Symposium Review – Advanced Packaging Development
by Tom Dillinger on 06-27-2022 at 6:00 am

3D blox

TSMC recently held their annual Technology Symposium in Santa Clara, CA.  The presentations provide a comprehensive overview of their technology status and upcoming roadmap, covering all facets of the process technology and advanced packaging development.  This article will summarize the highlights of the advanced packaging… Read More


Multiphysics, Multivariate Analysis: An Imperative for Today’s 3D-IC Designs

Multiphysics, Multivariate Analysis: An Imperative for Today’s 3D-IC Designs
by Daniel Nenni on 06-26-2022 at 6:00 am

Ansys Heat Map

Semiconductor manufacturers are under constantly increasing and intense pressure to accelerate innovative new chip designs to market faster than ever in smaller package sizes while assuring signal integrity and reducing power consumption. Three-dimensional integrated circuits (3D-ICs) promise to answer all these demands… Read More


ASML EUV Update at SPIE

ASML EUV Update at SPIE
by Scotten Jones on 06-24-2022 at 6:00 am

12051 4 SPIE2022 Smeets 0.33 NA EUV systems for High Volume Manufacturing Page 07

At the 2022 SPIE Advanced Lithography Conference, ASML presented an update on EUV. I recently had a chance to go over the presentations with Mike Lercel of ASML. The following is a summary of our discussions.

0.33 NA

The 0.33 NA EUV systems are the production workhorse systems for leading edge lithography today. 0.33 NA systems are… Read More


TSMC 2022 Technology Symposium Review – Process Technology Development

TSMC 2022 Technology Symposium Review – Process Technology Development
by Tom Dillinger on 06-22-2022 at 5:00 am

finFLEX

TSMC recently held their annual Technology Symposium in Santa Clara, CA.  The presentations provided a comprehensive overview of their status and upcoming roadmap, covering all facets of process technology and advanced packaging development.  This article will summarize the highlights of the process technology updates… Read More


Three Key Takeaways from the 2022 TSMC Technical Symposium!

Three Key Takeaways from the 2022 TSMC Technical Symposium!
by Daniel Nenni on 06-16-2022 at 12:10 pm

TSMC Technology Roadmap 2022

The TSMC Technical Symposium is today so I wanted to give you a brief summary of what was presented. Tom Dillinger will do a more technical review as he has done in the past. I don’t want to steal his thunder but here is what I think are the key takeaways. First a brief history lesson.

The history of TSMC Technology Development with 12 keyRead More


Intel 4 Deep Dive

Intel 4 Deep Dive
by Scotten Jones on 06-13-2022 at 6:00 am

Figure 1

As I previously wrote about here, Intel is presenting their Intel 4 process at the VLSI Technology conference. Last Wednesday Bernhard Sell (Ben) from Intel gave the press a briefing on the process and provided us with early access to the paper (embargoed until Sunday 6/12).

“Intel 4 CMOS Technology Featuring Advanced FinFET TransistorsRead More


WEBINAR: 5G is moving to a new and Open Platform O-RAN or Open Radio Access Network

WEBINAR: 5G is moving to a new and Open Platform O-RAN or Open Radio Access Network
by Daniel Nenni on 06-10-2022 at 6:00 am

The demands of 5G requires new designs to not only save power but also increase performance and by moving to advance power-saving nodes and by using eFPGAs will help to achieve these goals. This paper will introduce 5G and O-RAN, the complexity of these systems, and how flexibility could be beneficial. Then we will dive into how eFPGA… Read More


An Update on In-Line Wafer Inspection Technology

An Update on In-Line Wafer Inspection Technology
by Tom Dillinger on 06-06-2022 at 6:00 am

inspection overview

From initial process technology development (TD) to high volume manufacturing (HVM) status for a new node, one of the key support functions to improve and maintain yield is the in-line wafer inspection technology.  Actually, there are multiple inspection technologies commonly employed, with tradeoffs in pixel resolution,… Read More