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Aart de Geus At the Heart of Impact!

Aart de Geus At the Heart of Impact!
by Alex Tan on 03-26-2018 at 7:00 am

At the Silicon Valley SNUG 2018, Synopsys Chairman and co-CEO Dr. Aart de Geuss gave his keynote speech addressing attendees on how far we have evolved, and at times encountered the aha factor that helps propel us to the next level. He explored trends as well as the current state of his company solution offerings.


Moore’s Law, Digital
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Free Webinar: Silvaco 3D Solver Based Extraction for Device and Circuit Designers

Free Webinar: Silvaco 3D Solver Based Extraction for Device and Circuit Designers
by admin on 03-20-2018 at 12:00 pm

Designers spend a lot of time looking at their layouts in 2D. This is done naturally because viewing in 2D is faster and simpler than in 3D. It helps that humans are good at extrapolating from 2D to 3D. Analysis software, such as extraction software also spend a lot of time looking at layouts in 2D. While this is fine for approximate results,… Read More


Don’t Stand Between The Anonymous Bug and Tape-Out (Part 2 of 2)

Don’t Stand Between The Anonymous Bug and Tape-Out (Part 2 of 2)
by Alex Tan on 03-16-2018 at 7:00 am


The second panel is about system coverage and big data. Coverage metrics have been used to gauge the quality of verification efforts during development. At system level, there are still no standardized metrics to measure full coverage. The emergence of PSS, better formal verification, enhanced emulation and prototyping techniques… Read More


Webinar Alert – Embedded Monitoring of Process and Voltage in SoCs

Webinar Alert – Embedded Monitoring of Process and Voltage in SoCs
by Daniel Payne on 03-13-2018 at 12:00 pm

In the old days to learn about new semiconductor IP you would have to schedule a sales call, listen to the pitch, then decide if the IP was promising or not. Today we have webinars which offer a lot less drama than a sales call, plus you get to ask your questions by typing away at the comfort of your desk, hopefully wearing headphones as … Read More


An Advanced-User View of Applied Formal

An Advanced-User View of Applied Formal
by Bernard Murphy on 03-08-2018 at 7:00 am

Thanks to my growing involvement in formal (at least in writing about it), I was happy to accept an invite to this year’s Oski DVCon dinner / Formal Leadership Summit. In addition to Oski folks and Brian Bailey (an esteemed colleague at another blog site, to steal a Frank Schirrmeister line), a lively group of formal users attended… Read More


Students Should Attend DAC in SFO

Students Should Attend DAC in SFO
by Daniel Payne on 03-06-2018 at 12:00 pm

On LinkedIn I have some 2,116 connections and many of those are students looking to enter the field of EDA, IP or semiconductor design. What a wonderful opportunity these students have by attending the 55th annual DAC in San Francisco this summer from June 24-28. Technical sessions, keynote speeches, exhibitors, networking, … Read More


SPIE Advanced Lithography 2018 – EUV Status

SPIE Advanced Lithography 2018 – EUV Status
by Scotten Jones on 03-05-2018 at 7:00 am

This year the Advanced Lithography Conference felt very different to me than the last couple of years. I think it was Chris Mack who proclaimed it the year of Stochastics. EUV has dominated the conference for the last several years but in the past the conversation has been mostly centered on the systems, system power and uptime.

I … Read More


LithoVision 2018 The Evolving Semiconductor Technology Landscape and What it Means for Lithography

LithoVision 2018 The Evolving Semiconductor Technology Landscape and What it Means for Lithography
by Scotten Jones on 02-25-2018 at 5:00 pm

I was invited to present at Nikon’s LithoVision event held the day before the SPIE Advanced Lithography Conference in San Jose. The following is a write up of the talk I gave. In this talk I discuss the three main segments in the semiconductor industry, NAND, DRAM and Logic and how technology transitions will affect lithography.… Read More


Herb Reiter on the Challenges of 2.5D ASIC SiPs

Herb Reiter on the Challenges of 2.5D ASIC SiPs
by Daniel Nenni on 02-23-2018 at 12:00 pm

Years ago my good friend Herb Reiter promoted the importance of 2.5D packaging to anybody and everybody who would listen including myself. Today Herb’s vision is in production and the topic of many papers, webinars, and conferences. According to Herb, and I agree completely, advanced IC packaging is an important technology for… Read More


SPIE 2018 Mentor Graphics Scott Jones and SemiWiki

SPIE 2018 Mentor Graphics Scott Jones and SemiWiki
by Daniel Nenni on 02-21-2018 at 7:00 am

Next week is SPIE, the leading lithography networking event here in Silicon Valley. Scott Jones is not only attending but also presenting at the 15th Annual LithoVision on Sunday. I will be at SPIE as well so if you want to meet up let us know. We will publish a blog on Scott’s presentation the morning of for those who cannot attend.… Read More