Power delivery networks (PDN) are the metal structures on a chip that delivers the power. In a high-end desktop SoC this might be delivering as much as 150W, and with voltages around 1V that means over 150 amps of current. Clearly getting the PDN correct is critical for a correctly functioning chip. One of the challenges to verifying… Read More
Smart Strategies for Efficient Testing of 3D-ICs
3D-IC has a stack of dies connected and packaged together, and therefore needs new testing strategies other than testing a single die. It’s given that a single defective die can render the whole of 3D-IC unusable, so each die in the stack must be completely and perfectly tested before its entry into that stack. Looking at it from a … Read More
Verification Execution: When will we get it right?
Verification technologist Hemendra Talesaraattended a conference in Austin and asked me to post this article on verification execution for him as a blog. I first met Hemendra when he worked at XtremeEDA, and now he works at Synapse Design Automation – a design services company.
“In theory there is no difference between … Read More
Verification Execution: When will we get it right?
Verification technologist Hemendra Talesaraattended a conference in Austin and asked me to post this article on verification execution for him as a blog. I first met Hemendra when he worked at XtremeEDA, and now he works at Synapse Design Automation – a design services company.
“In theory there is no difference between … Read More
TSMC OIP presentations available!
Are you a TSMC customer or partner? If so, you’ll want to take a look at these presentations from the 2013 TSMC Open Innovation Platform conference:
- Design Reliability with Calibre YE-SmartFill and Calibre PERC (Broadcom & Mentor Graphics)
New methodologies were developed for 28nm designs using Calibre SmartFill and Calibre
Stop TDDB from getting through peanut butter
There are a few dozen causes of semiconductor failure. Most can be lumped into one of three categories: material defects, process or workmanship issues, or environmental or operational overstress. Even when all those causes are carefully mitigated, one factor is limiting reliability more as geometries shrink – and it… Read More
Managing Heat for System Reliability
In most of the electronic equipments, semiconductor chips are a major source of heat generation. And in semiconductor designs several hardware and software techniques are being used to contain power dissipation; a major cause for heat. However due to multiple functionality being squeezed into small form factors, we continue… Read More
Mentor Buys Oasys
Mentor is acquiring Oasys, subject to all the usual caveats about shareholder and regulatory approval. The shareholder paperwork went out earlier this week. The common stock is valueless so presumably the price is low (and Mentor historically has not paid high prices for its acquisitions).
So what is going to happen with the technology?… Read More
Capturing Analog Design Intent with Verification
Analog IC designers are gradually adopting what digital IC designers have been doing for years, metric driven verification. When you talk with analog designers about their methodology and approach, you hear terms like artisan being used which implies mostly a manually-oriented methodology. Thanks to automation from EDA companies,… Read More
IoT begets silicon, interoperability, and standards
The Internet of Things is on every technology mind these days, but what does it mean for the EDA community? Dennis Brophy of Mentor Graphics says the billions of things we are hearing about will not happen unless we find a way to build a lot more things, efficient things, and connected things. He has more thoughts in our recent interview.… Read More