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Driving the Future of HPC Through 224G Ethernet IP

Driving the Future of HPC Through 224G Ethernet IP
by Kalar Rajendiran on 05-23-2023 at 10:00 am

Advanced DSP Implementations

The need for speed is a never-ending story when it comes to data communications. Currently there are a number of trends such as cloud computing, artificial intelligence, Internet of Things (IoT), multimedia applications and consumer expectations driving this demand. All of these trends are accelerating the growth in high-performance-computing… Read More


US giant swoops for British chipmaker months after Chinese sale blocked on national security grounds

US giant swoops for British chipmaker months after Chinese sale blocked on national security grounds
by Daniel Nenni on 05-21-2023 at 6:00 pm

UK US CHina Semiconductor Battle

According to UK based The Telegraph Pulsic is a chip maker and Cadence is a swooping US giant.  I guess you have to stretch the truth to get those precious clicks these days. Even so this is a strategic acquisition for Cadence.

Pulsic is a 20+ year old EDA software company that offers chip planning and implementation software for custom… Read More


Chiplet Q&A with John Lee of Ansys

Chiplet Q&A with John Lee of Ansys
by Daniel Nenni on 05-19-2023 at 6:00 am

SNUG Panel

At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was John Lee, Head of Electronics, Semiconductors and Optics at Ansys.

How is the signoff flow evolving and what is being done to help mitigate the growing signoff complexity challenge?

With… Read More


Opinions on Generative AI at CadenceLIVE

Opinions on Generative AI at CadenceLIVE
by Bernard Murphy on 05-18-2023 at 6:00 am

Generative AI

According to some AI dreamers, we’re almost there. We’ll no longer need hardware or software design experts—just someone to input basic requirements from which fully realized system technologies will drop out the other end. Expert opinions in the industry are enthusiastic but less hyperbolic. Bob O’Donnell, president, founder… Read More


Ansys Acquires Another!

Ansys Acquires Another!
by Daniel Nenni on 05-16-2023 at 4:00 pm

Diakopto logo

The headline is: Ansys Signs Definitive Agreement to Acquire Diakopto, Expands Multiphysics Simulation Portfolio for Semiconductor Designers. The acquisition complements Ansys’ existing signoff solutions and enables integrated circuit (IC) designers to detect problems earlier in the design flow.

Which is certainly… Read More


Emerging Stronger from the Downturn

Emerging Stronger from the Downturn
by Kalar Rajendiran on 05-16-2023 at 6:00 am

Full Flow from HL Synthesis through to GDSII Accelerates the creation of AI IP

It was refreshing to hear a talk focused on emerging stronger from the downturn when the news and media are focused on the gloom. At the recent Siemens EDA User2User conference, Joe Sawicki, executive vice president, IC, gave an uplifting keynote talk to the audience. He highlighted a secular growth trend happening in the semiconductor… Read More


Overcoming Semiconductor Supply Chain Bottlenecks

Overcoming Semiconductor Supply Chain Bottlenecks
by Daniel Payne on 05-15-2023 at 10:00 am

supply chain, PLM and IPLM

During the recent COVID pandemic it was common to read about automobile companies unable to deliver new vehicles, caused by the shortage of specific automotive chips. Even bad weather has shut down the supply of semiconductor parts to certain customers. This disruption of the IC supply chain has caused many companies that buy … Read More


Chiplet Modeling and Workflow Standardization Through CDX

Chiplet Modeling and Workflow Standardization Through CDX
by Kalar Rajendiran on 05-15-2023 at 6:00 am

Chiplet Integration Workflow

Chiplet is a hot topic in the semiconductor world these days. So much so that if one hasn’t heard that term, the person must be living on a very isolated islet. Humor aside, products built using chiplets-based methodology have been in existence for at least some years now. Companies such as Intel, AMD, Apple and others have integrated… Read More


SEMI ESD Alliance CEO Outlook Sponsored by Keysight Promises Industry Perspectives, Insights

SEMI ESD Alliance CEO Outlook Sponsored by Keysight Promises Industry Perspectives, Insights
by Bob Smith on 05-11-2023 at 10:00 am

ESDA CEO Outlook

Spring wouldn’t be the same without an opportunity to hear from some of the most visible executives of electronic system design (ESD) market segment. The in-person CEO Outlook sponsored by Keysight and hosted by the ESD Alliance, a SEMI Technology Community, will be held Thursday, May 18, in Santa Clara, Calif.

Attendees can expect… Read More


Takeaways from CadenceLIVE 2023

Takeaways from CadenceLIVE 2023
by Bernard Murphy on 05-11-2023 at 6:00 am

Takeways image

Given popular fascination it seems impossible these days to talk about anything other than AI. At CadenceLIVE, it was refreshing to be reminded that the foundational methods on which designs of any type remain and will always be dominated in all aspects of engineering by deep, precise, and scalable math, physics, computer science… Read More