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Dan is joined by Cristian Macario, senior technical professional at MathWorks, where he leads global strategy for the semiconductor segment. With a background in electronics engineering and over 15 years of experience spanning semiconductor design, verification, and strategic marketing, Cristian bridges engineering … Read More
Modern EVs are prime examples of software-defined systems, so I attended a #62DAC panel session hosted by Siemens to learn more from experts at Collins Aerospace, Arm, AMD and Siemens. Here’s the list of panelists that span several domains, and what follows is my paraphrase of the discussion topics.
Panel Discussion
Q: How does… Read More
AI was everywhere at DAC. Presentations, panel discussions, research papers and poster sessions all had a strong dose of AI. At the DAC Pavillion on Monday two heavy weights in the industry, Siemens and NVIDIA took the stage to discuss AI for design, both present and future. What made this event stand out for me was the substantial… Read More
My first panel discussion at DAC 2025 was all about using AI for digital implementation, as Siemens has a digital implementation tool called Aprisa which has been augmented with AI to produce better results, faster. Panelists were from Samsung, Broadcom, MaxLinear, AWS and Siemens. In the past it could take an SoC design team… Read More
As we all know, the age of multi-die design has arrived. And along with it many new design challenges. There is a lot of material discussing the obstacles to achieve more mainstream access to this design architecture, and some good strategies to conquer those obstacles. Synopsys recently published a webinar that took this discussion… Read More
The Granta EduPack White Paper on Materials Selection, authored by Harriet Parnell, Kaitlin Tyler, and Mike Ashby, presents a practical and educational guide to selecting materials in engineering design. Developed by Ansys and based on Ashby’s well-known methodologies, the paper outlines a four-step process to help learners… Read More
Dan is joined by John O’Donnell, Founder and CEO of yieldHUB, a pioneering leader in advanced data analytics for the semiconductor industry. Since establishing the company in 2005 he has transformed it from a two-person startup into a trusted multinational partner that empowers some of the world’s leading semiconductor companies… Read More
AI’s exponential growth is transforming semiconductor design—and memory is now as critical as compute. Multi-die architecture has emerged as the new frontier, and custom High Bandwidth Memory (cHBM) is fast becoming a cornerstone in this evolution. In a panel session at the Synopsys Executive Forum, leaders from AWS, Marvell,… Read More
We have a shortage of reference designs to test detection of security vulnerabilities. An LLM-based method demonstrates how to fix that problem with structured prompt engineering. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford,… Read More
Calibre is a well-known EDA tool from Siemens that is used for physical verification, but I didn’t really know how AI technology was being used, so I attended a Tuesday session at #62DAC to get up to speed. Priyank Jain, Calibre Product Management presented slides and finished up with a Q&A session.
In the semiconductor world… Read More
Making Intel Great Again!