wide 1
WP_Term Object
(
    [term_id] => 157
    [name] => EDA
    [slug] => eda
    [term_group] => 0
    [term_taxonomy_id] => 157
    [taxonomy] => category
    [description] => Electronic Design Automation
    [parent] => 0
    [count] => 4200
    [filter] => raw
    [cat_ID] => 157
    [category_count] => 4200
    [category_description] => Electronic Design Automation
    [cat_name] => EDA
    [category_nicename] => eda
    [category_parent] => 0
    [is_post] => 
)

Enabling the Ecosystem for True Heterogeneous 3D IC Designs

Enabling the Ecosystem for True Heterogeneous 3D IC Designs
by Kalar Rajendiran on 07-28-2025 at 10:00 am

The Shift to System Technology Co Optimization

The demand for higher performance, greater configurability, and more cost-effective solutions is pushing the industry toward heterogeneous integration and 3D integrated circuits (3D ICs). These solutions are no longer reserved for niche applications—they are rapidly becoming essential to mainstream semiconductor design.… Read More


Podcast EP299: The Current and Future Capabilities of Static Verification at Synopsys with Rimpy Chugh

Podcast EP299: The Current and Future Capabilities of Static Verification at Synopsys with Rimpy Chugh
by Daniel Nenni on 07-25-2025 at 10:00 am

Dan is joined by Rimpy Chugh, a Principal Product Manager at Synopsys with 14 years of varied experience in EDA and functional verification. Prior to joining Synopsys, Rimpy held field applications and verification engineering positions at Mentor Graphics, Cadence and HCL Technologies.

Dan explores the expanding role of static… Read More


Griffin Securities’ Jay Vleeschhouwer on EDA Acquisitions and Startups

Griffin Securities’ Jay Vleeschhouwer on EDA Acquisitions and Startups
by Bob Smith on 07-25-2025 at 6:00 am

jay vleeschhouwer SemiWiki Interview

Jay Vleeschhouwer, Managing Director of Software Research at Griffin Securities, is a noted financial analyst who does a yearly presentation on the State of EDA during the Design Automation Conference (DAC). This year was no exception. He and I spent a memorable afternoon discussing the Synopsys-Ansys merger and startups. … Read More


Scaling 3D IC Technologies – Siemens Hosts a Meeting of the Minds at DAC

Scaling 3D IC Technologies – Siemens Hosts a Meeting of the Minds at DAC
by Mike Gianfagna on 07-24-2025 at 6:00 am

Scaling 3D IC Technologies – Siemens Hosts a Meeting of the Minds at DAC

3D IC was a very popular topic at DAC. The era of heterogeneous, multi-chip design is here.  There were a lot of research results and practical examples presented. What stood out for me was a panel at the end of day two of DAC that was hosted by Siemens. This panel brought together an impressive group of experts to weigh in on what was really… Read More


Analysis and Exploration of Parasitic Effects

Analysis and Exploration of Parasitic Effects
by Daniel Payne on 07-23-2025 at 10:00 am

parasitc elements min

With advanced semiconductor processes continuing to shrink, the number and complexity of parasitic elements in designs grows exponentially contributing to one of the most significant bottlenecks in the design flow. Undetected parasitic-induced issues can be extremely costly, often resulting in tape-out delays.

Silvaco… Read More


Siemens Proposes Unified Static and Formal Verification with AI

Siemens Proposes Unified Static and Formal Verification with AI
by Bernard Murphy on 07-23-2025 at 6:00 am

Siemens Proposes Unified Static and Formal Verification with AI min

Given my SpyGlass background I always keep an eye out for new ideas that might be emerging in static and formal verification. Whatever can be covered through stimulus-free analysis reduces time that needn’t be wasted in dynamic analysis, also adding certainty to coverage across that range. Still, advances don’t come easily. … Read More


Protecting Sensitive Analog and RF Signals with Net Shielding

Protecting Sensitive Analog and RF Signals with Net Shielding
by Admin on 07-21-2025 at 6:00 am

fig1 net shielding 72dpi

By Hossam Sarhan

Communication has become the backbone of our modern world, driving the rapid growth of the integrated circuit (IC) industry, particularly in communication and automotive applications. These applications have increased the demand for high-performance analog and radio frequency (RF) designs.

However, designing… Read More


New Cooling Strategies for Future Computing

New Cooling Strategies for Future Computing
by Daniel Payne on 07-17-2025 at 10:00 am

thermal panel dac min

Power densities on chips increased from 50-100 W/cm2 in 2010 to 200 W/cm2 in 2020, creating a significant challenge in removing and spreading heat to ensure reliable chip operation. The DAC 2025 panel discussion on new cooling strategies for future computing featured experts from NVIDIA Research, Cadence, ESL/EPFL, the University… Read More


Sophisticated soundscapes usher in cache-coherent multicore DSP

Sophisticated soundscapes usher in cache-coherent multicore DSP
by Don Dingee on 07-16-2025 at 10:00 am

A Tensilica 2 to 8 core SMP DSP adds cache-coherence for high-end audio processing and other applications

Digital audio processing is evolving into an art form, particularly in high-end applications such as automotive, cinema, and home theater. Innovation is moving beyond spatial audio technologies to concepts such as environmental correction and spatial confinement. These sophisticated soundscapes are driving a sudden increase… Read More


Improve Precision of Parasitic Extraction for Digital Designs

Improve Precision of Parasitic Extraction for Digital Designs
by Admin on 07-15-2025 at 10:00 am

fig1 pex process

By Mark Tawfik

Parasitic extraction is essential in integrated circuit (IC) design, as it identifies unintended resistances, capacitances, and inductances that can impact circuit performance. These parasitic elements arise from the layout and interconnects of the circuit and can affect signal integrity, power consumption,… Read More