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Lip-Bu Tan to be Honored With 2025 Phil Kaufman Award

Daniel Nenni

Admin
Staff member
August 25, 2025

Tan Recognized for His Leadership and Business Impact on the Electronic Design Automation Industry

MILPITAS, Calif. –– August 25, 2025 –– Lip-Bu Tan, Chief Executive Officer of Intel Corporation and former CEO of Cadence Design Systems, will be honored with the 2025 Phil Kaufman Award for distinguished contributions to Electronic System Design (ESD).

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The annual award from the Electronic System Design Alliance (ESD Alliance), a SEMI technology community, and the Council on Electronic Design Automation (CEDA) of the Institute of Electrical and Electronics Engineers (IEEE) will be presented at the Phil Kaufman Award presentation and banquet, November 6 in San Jose, Calif. The organizations are honoring Tan for his leadership and impact on the ESD industry.

“Lip-Bu Tan has played a pivotal role in shaping the trajectory of the semiconductor industry through his visionary leadership and strategic initiatives,” said Alberto Sangiovanni-Vincentelli, the Edgar L. and Harold H. Buttner Chair of Electrical Engineering and Computer Sciences at the University of California at Berkeley and previous Phil Kaufman Award honoree. “His ability to anticipate critical technology trends well ahead of the curve, combined with his deep understanding of the innovation ecosystem, allows him to bridge early-stage innovation with industry-scale impact. Lip-Bu's visionary leadership continues to accelerate the growth of startups, drive collaboration across the value chain, and define the future of semiconductor design and manufacturing.”

“I have the deepest respect for Lip-Bu Tan, both for his dedicated industry leadership and for our shared belief in the central role semiconductors play in technology innovation and the impact it can have on humanity,” said Ajit Manocha, SEMI President and CEO. “Lip-Bu truly puts his heart and soul into his work to advance the semiconductor industry, and SEMI congratulates him on being named the Phil Kaufman Award recipient for his efforts throughout his career. He oversaw vital EDA advancements at Cadence that underpinned industry growth and has been an ongoing supporter of SEMI and the ESD Alliance as platforms for industry collaborations to foster innovation.”

Walden Rhines, Chairman former CEO of Mentor Graphics (now Siemens EDA), previous Phil Kaufman Award recipient, and member of the board of numerous electronic design automation (EDA) companies, added, “Lip-Bu has served as a true ambassador for the broader semiconductor and EDA industries. Through his active participation in industry forums and his leadership in educational and philanthropic initiatives, he has advanced the visibility and impact of EDA across the tech ecosystem. His support for startups and emerging technologies has helped catalyze innovation across the semiconductor value chain and reinforced the critical role of design automation in driving the industry forward.”

“As a former ESD Alliance board member, Lip-Bu actively encouraged and supported educational and business activities aimed at advancing the entire EDA ecosystem,” said Bob Smith, Executive Director of the ESD Alliance. “On behalf of the ESD Alliance, I congratulate Lip-Bu on being honored with the well-deserved 2025 Phil Kaufman award.”

L. Miguel Silveira, Full Professor in the Department of Electrical and Computer Engineering at Instituto Superior Técnico (IST), Universidade de Lisboa and President of the IEEE Council on EDA added, “Lip-Bu Tan’s dedication to technical leadership, mentorship, and business acumen has made him a key contributor to the advancement of the EDA and semiconductor industries. The IEEE Council on EDA congratulates Lip-Bu on being selected for the 2025 Phil Kaufman Award.”

About Lip-Bu Tan
Lip-Bu Tan is chief executive officer of Intel Corporation and serves on the company’s board of directors. He was appointed to his position in March 2025 and is driving a transformation of Intel to develop a new generation of industry-leading products, deliver new AI systems, and build a trusted, U.S.-based, leading-edge foundry.

Tan is an accomplished executive with more than two decades of semiconductor and software experience and deep relationships across the technology ecosystem. He has received several accolades for his significant contributions to the industry, including the 2022 Robert N. Noyce Award, the Semiconductor Industry Association’s highest honor, and was named one of Forbes’ Top 50 Venture Capitalists.

Tan previously served as chief executive officer of Cadence Design Systems Inc. and was also a member of its board of directors. During his 12 years as Cadence’s chief executive officer, he led a reinvention of the company and drove a cultural transformation centered on customer-centric innovation that enabled Cadence to more than double its revenue, expand operating margins and significantly outperform the market.

Tan is a founding managing partner of Walden Catalyst Ventures and chairman of Walden International, a leading venture capital firm. He has also served on the boards of public companies Credo Technology Group and Schneider Electric.

Tan holds a Bachelor of Science in physics from Nanyang Technological University in Singapore, a Master of Science in nuclear engineering from the Massachusetts Institute of Technology and an MBA from the University of San Francisco. He was awarded an Honorary Doctorate in Science and Technology from Carnegie Mellon University in 2025.

About the Phil Kaufman Award
The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers. The 2024 recipient was Dr. Jason Cong, Distinguished Professor and Volgenau Chair for Engineering Excellence at the University of California, Los Angeles (UCLA).

About the IEEE Council on Electronic Design Automation (CEDA)
The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across seven IEEE societies (Antennas and Propagation, Circuits and Systems, Computer, Electron Devices, Electronics Packaging, Microwave Theory and Techniques, and Solid-State Circuits). The Council sponsors or co-sponsors over a dozen key EDA conferences including: the Design Automation Conference (DAC), Asia and South Pacific Design Automation Conference (ASP-DAC), International Conference on Computer-Aided Design (ICCAD), Design Automation and Test in Europe (DATE), and events at Embedded Systems Week (ESWEEK). The Council also publishes IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems (TCAD), IEEE Design & Test (D&T), and IEEE Embedded Systems Letters (ESL). The Council boasts a prestigious awards program in order to promote the recognition of leading EDA professionals, which includes the A. Richard Newton, Phil Kaufman, and Ernest S. Kuh Early Career Awards. The Council welcomes new volunteers and local chapters.

Stay in Touch with IEEE CEDA
About the Electronic System Design Alliance
The ESD Alliance, a SEMI Technology Community, offers initiatives and activities that bring value to our entire industry including:
  • Coordinating and amplifying the collective and regional voices of the industry.
  • Continually promoting the value the industry delivers to the global semiconductor and electronics industry.
  • Addressing and defending threats and reducing risks to the industry.
  • Achieving efficiencies for the industry.
  • Marketing the attractiveness of the design ecosystem as an ideal industry for pursuing a career.
  • Enabling networking, sharing and collaboration across the industry.
Contact Paul Cohen at pcohen@semi.org or Bob Smith at bsmith@semi.org for more details.

Follow the ESD Alliance
About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

All trademarks and registered trademarks are the property of their respective owners.

Association Contacts
Nanette Collins/ESDA
Phone: 1.617.437.1822
Email: nanette@nvc.com
Sherrie Gutierrez / SEMI
Phone: 1.831.889.3800
Email: sgutierrez@semi.org
Laura Paul/IEEE-CEDA
Phone: 1.352.872.5544 Ext. 805
Email: admin@ieee-ceda.org
Stephanie Quinn/Kiterocket (Media Inquiries)
Phone: 1.480.316.8370
Email: squinn@kiterocket.com
 
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