SILVACO 073125 Webinar 800x100
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WEBINAR: A Revolution in Prototyping and Emulation

WEBINAR: A Revolution in Prototyping and Emulation
by Daniel Nenni on 08-23-2022 at 6:00 am

MimicPro Picture

This webinar will introduce to you a revolutionary new way to do prototyping and emulation at best-in-class performance, productivity, and pricing by unifying the hardware and a new software stack so one system is capable of prototyping and delivering essential emulation functionality.

Register Here

The speed of Moore’s law… Read More


UVM Polymorphism is Your Friend

UVM Polymorphism is Your Friend
by Bernard Murphy on 08-17-2022 at 6:00 am

Polymorphism min

Rich Edelman of Siemens EDA recently released a paper on this topic. I’ve known Rich since our days together back in National Semi. And I’ve always been impressed by his ability to make a complex topic more understandable to us lesser mortals. He tackles a tough one in this paper – a complex concept (polymorphism) in a complex domain… Read More


Delivering 3D IC Innovations Faster

Delivering 3D IC Innovations Faster
by Kalar Rajendiran on 08-16-2022 at 6:00 am

System Technology Co Optimization STCO

3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic of discussion. The technology was originally leveraged for stacking functional blocks with high-bandwidth buses between them. Memory manufacturers and other IDMs were the ones to typically leverage this … Read More


Digital Twins Simplify System Analysis

Digital Twins Simplify System Analysis
by Dave Bursky on 08-15-2022 at 6:00 am

Siemens Digital Twin SemiWiki

The ability to digitally replicate physical systems has been used to model hardware operations for many years, and more recently, digital twining technology has been applied to electronic systems to better simulate and troubleshoot the systems. As explained by Bryan Ramirez, Director of Industries, Solutions & Ecosystems,… Read More


Understanding Sheath Behavior Key to Plasma Etch

Understanding Sheath Behavior Key to Plasma Etch
by Scott Kruger on 08-11-2022 at 10:00 am

Final Edit EtchingProcess Illustration

Readers of SemiWiki will be well aware of the challenges the industry has faced in photolithography in moving to new nodes, which drove the development of new EUV light sources as well as new masking techniques.  Plasma etching is another key step in chip manufacturing that has also seen new challenges in the development of new sub-10nm… Read More


Coverage Analysis in Questa Visualizer

Coverage Analysis in Questa Visualizer
by Bernard Murphy on 08-10-2022 at 6:00 am

Questa coverage

Coverage analysis is how you answer the question “have I tested enough?” You need some way to quantify the completeness of our testing; coverage is how you do that. Right out of the gate this is a bit deceptive. To truly cover a design our tests would need to cover every accessible state and state transition. The complexity of that task… Read More


Fast EM/IR Analysis, a new EDA Category

Fast EM/IR Analysis, a new EDA Category
by Daniel Payne on 08-09-2022 at 6:00 am

IR Drop min

I’ve watched the SPICE market segment into multiple approaches, like: Classic SPICE, Parallel SPICE, FastSPICE and Analog FastSPICE. In a similar fashion the same thing just happened to EM/IR analysis, because after years of waiting we finally have a different approach to EM/IR analysis that works at the top-level of … Read More


A Solid Methodology is the Margin of Victory

A Solid Methodology is the Margin of Victory
by Mike Gianfagna on 08-02-2022 at 6:00 am

A Solid Methodology is the Margin of Victory

Designing complex systems is difficult. It seems to me that the difficulty has increased at a rate that is more exponential than linear with design complexity. Some version of Moore’s law for design is at work. The challenges for advanced designs just seem to keep mounting. A new item that is top of mind for many executives is the talent… Read More


EDA in the Cloud with Siemens EDA at #59DAC

EDA in the Cloud with Siemens EDA at #59DAC
by Daniel Payne on 08-01-2022 at 10:00 am

craig johnson

Tuesday at DAC I had the pleasure of attending the Design on Cloud Theatre where experts from Siemens EDA gave an update on what they’ve been offering to IC and systems designers. I remember attending a cloud presentation from Craig Johnson in 2021, so I was keen to note what had changed in the past 12 months.

Industry Trends,

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Formal at System Level. Innovation in Verification

Formal at System Level. Innovation in Verification
by Bernard Murphy on 07-27-2022 at 6:00 am

Innovation New

Formal verification at the SoC level has long seemed an unapproachable requirement. Maybe we should change our approach. Could formal be practical on a suitable abstraction of the SoC? Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and now Silvaco CTO) and… Read More