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Electronic Design Automation
China Mobile’s bid to go for 3-mode Long-Term Evolution (LTE) has led to the first major breakthrough, $65 LTE handsets, and here baseband and application processors provided by chipmakers like Leadcore Technology, MediaTek and Spreadtrum Communications have all one thing in common: DSP cores from CEVA Inc.
The advent… Read More
ESD stands for electro-static discharge and deals with the fact that chips have to survive in an electrically hostile environment: people, testers, assembly equipment, shipping tubes. All of these can carry electric charge that has the “potential” (ho-ho) to damage the chip irreversibly. Historically this was… Read More
I remember a couple of decades ago, my father used to go to a nearby doctor’s clinic to get his blood pressure and sugar levels checked. I guess, in around 1990s small electronic kits became available to measure these usual daily health indicators and instantly display the numbers. I bought a few for my father then. Today, the scene… Read More
Engineers love acronyms and my latest blog post has three acronyms in the title alone, so hopefully you are doing or considering SoC designs with the AMBA AXI4(Advanced eXtensible Interface 4) interface specification along with PCI Express (Peripheral Component Interconnect Express). One big motivation for using semiconductor… Read More
Earlier this week it was the Synopsys user group meeting SNUG. Not just any old SNUG but the 25th Annual SNUG. The first one was 15th March 1991 and was attended by 100 people. At the time, Synopsys had annual revenues of $22M. This year, the various SNUGs around the world will have a total attendance of 10,000 people and Synopsys revenue… Read More
Today an SoC cannot be without multiple IP blocks integrated together in the most optimal manner. In such an environment, it’s natural that interoperability and configurability of an IP get prime considerations to achieve the best PPA (Power, Performance and Area) for the SoC containing that IP. While PPA is a basic criterion … Read More
After teams sweat the details of SoC and industrial design, they turn to printed circuit board designers for magic. Here are a pile of chips and passives, and a schematic for interconnecting them. This is how much physical space the board can occupy. Connectors have to be here, and here, and mounting holes there, and there. There … Read More
Apple has redefined three industries within a decade: media player with the iPod, mobile handset with the iPhone and portable computers with the iPad. If there is anything common in these three game-changing product development stories other than Apple, it’s the ARM footprint. Even now the technology media is abuzz with speculation… Read More
These days, most of the innovative concepts in our cars are driven by electronics; not only infotainment systems, but also instrument clusters, safety systems including ADAS (Advanced Driver Assistance Systems), information displays, night vision, airbags, backup camera, stability control, and so on. The upcoming connected… Read More
You may know that up until now NAND flash has been a planar technology. But just as with SoC processes where we have had to go vertical to FinFETs, NAND flash has reached the limitations of scaling in the 20nm nodes and is also going vertical. It is not just a lithography issue but there are also reliability and voltage scaling issues.… Read More
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DAC 2026: The Trouble with John Cooley’s Troublemaker Panel