If we look back in the last century, performance and area were two main criteria for semiconductor chip design. All design tools and flows were concentrated towards optimizing those two aspects. As a result, density of chips started increasing and power became a critical factor. Now, Power, Performance and Area (PPA) are looked… Read More
Electronic Design Automation
Silvaco Swallows Invarian
Yesterday, Silvaco announced that it has acquired Invarian Inc. Details of the transaction were not disclosed.
Who is Invarian? They are a recognized leader in block-level to full-chip sign-off analysis for complex, high-performance ICs. Their unique methodology utilizes a parallel architecture and concurrent power-voltage-thermal… Read More
Full Spectrum Analog FastSPICE Useful for RF Designs on Bulk CMOS
It has been about a year since the acquisition of Berkeley Design Automation by Mentor Graphics. Berkeley was doing quite well in the somewhat crowded SPICE simulator market. In many respects they broke new ground for high speed and accurate SPICE simulators. Since the acquisition we know that former Berkeley executives are now… Read More
ARM & Cadence IP Partnership for Faster SoC Design
IP vendors always try to create differentiation, especially when designing protocol based IP. You can differentiate by building the most performing controller but you will probably miss the expectation of these customers who don’t search for performance but just compliance to a specific standard. Or the vendor may want to design… Read More
Exploring IP You Didn’t Design Yourself
Starvision Pro from Concept Engineering is a bit like one of those Leatherman multi-tools, it has a huge number of different functions, some of them fairly specialized but nonetheless incredibly useful. Many of these functions are unique to Starvision Pro, with nothing else like it on the market. Some new videos, produced by EDA… Read More
Mapping Focus and Dose onto BEOL Fabrication Effects
With today’s ArF based lithography using 193nm wavelength light, we are hard up against the limitations imposed by the Raleigh equation. Numerous clever things have been devised to maximize yield and reduce feature size. These include 2 beam lithography, multiple patterning, immersion litho processes to improve NA, thinner… Read More
Lake Tahoe: The Center of ESD Innovation
Almost anyone that is active in IC design will be “in touch” with Electrostatic Discharge (ESD) at some time (pun intended). Preventing ESD related IC failures remains something like black magic—at least it’s easy to get that feeling when you are trying to debug ESD failures. I/O and ESD layouts that resulted in excellent robustness… Read More
Shifting Chip Design Left!
In the traditional sense “Shift Left” is the process of making things simpler in an effort to make things faster. Shift Left was the theme of theDVCon keynote last week delivered by Synopsys co-founder and co-CEO Aart de Geus which is right on topic when it comes to modern semiconductor design and manufacturing, absolutely.
KEYNOTE:… Read More
CDC Verification: A Must for IP and SoCs
In the modern SoC era, verification is no longer a post-design activity. The verification strategy must be planned much earlier in the design cycle; otherwise the verification closure can become a never ending problem. Moreover, verification which appears to be complete may actually be incomplete because of undetected issues… Read More
Cadence’s New Implementation System Promises Better TAT and PPA
On Tuesday Cadence made a big announcement about their new physical implementation offering, Innovus, during the keynote address at the CDNLive event in Silicon Valley. Cadence CEO Lip-Bu Tan alluded to it during his kick off talk, and next up Anirudh Devgan, Senior Vice President, Digital & Signoff Group, filled in more … Read More
Intel 18A-P Pushes RibbonFET and Backside Power Beyond the First Generation