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IBIS-AMI Model Generation Simplified

IBIS-AMI Model Generation Simplified
by Tom Dillinger on 10-25-2018 at 12:00 pm

The increasing demand for data communication throughput between system components has driven the requirement for faster SerDes IP data rates. The complexity of the transmit (Tx) and receive (Rx) signal conditioning functions has correspondingly evolved. As a result, the simulation methodology for SerDes electrical interface… Read More


Highly Modular, AI Specialized, DNA 100 IP Core Target IoT to ADAS

Highly Modular, AI Specialized, DNA 100 IP Core Target IoT to ADAS
by Eric Esteve on 09-24-2018 at 7:00 am

The Cadence Tensilica DNA100 DSP IP core is not a one-size-fits-all device. But it’s highly modular in order to support AI processing at the edge, delivering from 0.5 TMAC for on-device IoT up to 10s or 100 TMACs to support autonomous vehicle (ADAS). If you remember the first talks about IoT and Cloud, a couple of years ago, the IoT … Read More


Meeting Analog Reliability Challenges Across the Product Life Cycle

Meeting Analog Reliability Challenges Across the Product Life Cycle
by Daniel Payne on 08-14-2018 at 12:00 pm

Create a panel discussion about analog IC design and reliability and my curiosity is instantly piqued, so I attended a luncheon discussion at #55DAC moderated by Steven Lewis of Cadence. The panelists were quite deep in their specialized fields:… Read More


A True Signoff for 7nm and Beyond

A True Signoff for 7nm and Beyond
by Alex Tan on 08-13-2018 at 12:00 pm

The Tale of Three Metrics
Meeting PPA (Performance, Power and Area) target is key to a successful design tapeout. These mainstream QoR (Quality of Results) metrics are rather empirical yet inter-correlated and have been expanded to be linked with other metrics such as yield, cost and reliability. While the recent CPU performance… Read More


Cadence Update on AMS Design and Verification at #55DAC

Cadence Update on AMS Design and Verification at #55DAC
by Daniel Payne on 08-06-2018 at 12:00 pm

As a blogger in the EDA industry I get more invitations to meet with folks at DAC than I have time slots, so I have to be a bit selective in who I meet. When the folks at Cadence asked me to sit down and chat with Mladen Nizic I was intrigued because Mladen is so well-known in the AMS language area and he’s one of the authors of, The Mixed-SignalRead More


An update on the Design Productivity Gap

An update on the Design Productivity Gap
by Tom Dillinger on 08-03-2018 at 12:00 pm

Over a decade ago, a group of semiconductor industry experts published a landmark paper as part of the periodic updates to the International Technology Roadmap for Semiconductors, or ITRS for short (link). The ITRS identified a critical design productivity gap. The circuit capacity afforded by the Moore’s Law pace of technology… Read More


Accelerating the PCB Design-Analysis Optimization Loop

Accelerating the PCB Design-Analysis Optimization Loop
by Tom Dillinger on 08-01-2018 at 12:00 pm

With the increasing complexity and diversity of the mechanical constraints and electrical requirements in electronic product development, printed circuit board designers are faced with a number of difficult challenges:

  • generating accurate (S-parameter) simulation models for critical interface elements of the design
Read More

Verification Importance in Academia

Verification Importance in Academia
by Alex Tan on 07-31-2018 at 12:00 pm

“Testing can only prove the presence of bugs, not their absence,” stated the famous computer scientist Edsger Dijkstra. That notion rings true to the many college participants of the Hack@DAC competition offered during DAC 2018 in San Francisco. The goal of this competition is to develop tools and methods for identifying security… Read More


1-on-1 with Anirudh Devgan, President, Cadence

1-on-1 with Anirudh Devgan, President, Cadence
by Tom Dillinger on 07-27-2018 at 12:00 pm

At the Design Automation Conference, no one is busier than an EDA company executive — conference panels, product launch briefings, customer meetings, and corporate dinners all place considerable demands on their time. I was fortunate enough to be able to meet with Anirudh Devgan, President of Cadence, at the recent DAC55 in San… Read More


Low Cost Power NB-IoT Solution? Fusion F1 DSP based Modem!

Low Cost Power NB-IoT Solution? Fusion F1 DSP based Modem!
by Eric Esteve on 07-26-2018 at 12:00 pm

Supporting NB-IoT requires low cost (optimized silicon footprint) and ultra-low power solution to cope with IoT device requirement. Cadence Fusion F1 DSP IP has been integrated in modem IC by two new customers, Xinyi and Rafael, gaining traction in NB-IoT market. These design-win builds on previous momentum: software GPS solution… Read More