I’ve written before about anti-fuse non-volatile memory, where the gate oxide is intentionally damaged in order to create a readable bit of data, but this is what most circuit designers never want to have happen to their logic gates. However, since the advent of MOS transistors the issue of Electrostatic Discharge (ESD) and the… Read More
Author: Tom Simon
Ultra-Low Power Non-Volatile Memory Solutions for the Smart Connected Universe
DAC is a great place to gather information about products and technologies. However it can be difficult to chase down the information you need because you may need to cover a lot of ground to hear or talk to the people with the right knowledge. Fortunately there are a few places you can go to learn about a number of products at one place.… Read More
Will Dark Silicon Dictate Server Blade Architecture?
Does the evil sounding phenomenon known as Dark Silicon create a big opportunity for FPGA vendors as was predicted recently by Pacific Crest Securities? John Vinh posits that using multiple cores as a method of scaling throughput is flattening out, and the use of FPGA’s to perform computation can help off-load and thus overcome… Read More
How Microtechnology Will Change Just About Everything
When I hear the term micro-technology my first thought is of accelerometers and gyroscopes. However as I’ll explain shortly, micro technology is being applied to a lot more than smartphones and quadcopters. The fruits of development in this area will affect industry, medical, energy, transportation and many other sectors. … Read More
How Sidense Sees The Smart Connected Universe
Sidenserecently conducted a webinar on what they call the Smart Connected Universe. They consider the Smart Connected Universe as something that includes a collection of market segments that are both smart and connected. This casts a big net, and includes what many are calling IoT, but goes further into medical, automotive and… Read More
Calibre xACT Shakes Up 16nm and Below Extraction Game
Mentor Graphics made a big announcement regarding SOC extraction at their User2User conference in San Jose during April. Before I get to the meat of the announcement, I’d like to reflect back on the early days of Calibre-DRC at Mentor. I was in Sales at Mentor around 1999, and Calibre-DRC was the new kid on the block. We had to go convince… Read More
TSV Modeling Key for Next Generation SOC Module Performance
The use of silicon interposers is growing. Several years ago Xilinx broke new ground by employing interposers in their Virtex®-7 H580T FPGA. Last August Samsung announced what they say is the first DDR4 module to use 3D TSV’s for enterprise servers. Their 64GB double data rate-4 modules will be used for high end computing where … Read More
Sidense NVM Scores Qualification on GLOBALFOUNDRIES 28nm SLP and HPP
A tremendous number of chips being designed for today’s products require some sort of onboard data storage. The size of these needs range from a handful of bytes, for trim and calibration storage, to something much more substantial like boot code storage. In both of these examples the storage ideally should be nonvolatile, with… Read More
ANSYS Event to Highlight Cutting Edge Technology Development
If you follow technology news, it would be hard to deny that we live in exciting times. In some ways there is an unparalleled amount of big and cool technology development going on right now. We all have followed the rise of Tesla Motors. They took over a long vacant US big-auto plant in Fremont and are reinventing the US automobile industry.… Read More
Intel and the Intel-of-Things
When I joined Calma in 1982, Intel was a small company making microprocessor chips in a crowded marketplace. They had scored big with IBM who was using their 8088 in the very first personal computer. Wind River was a hatchling with David Wilner and Jerry Fiddler working out of a rented warehouse in Berkeley – I know, I hung out… Read More
Achieving Seamless 1.6 Tbps Interoperability for High BW HPC AI/ML SoCs: A Technical Webinar with Samtec and Synopsys