SoC design these days has become a complex and tricky phenomenon involving integration of multiple IPs and legacy RTL code which could be in different languages, sourced from various third parties across the globe. Understanding and reusing RTL code is imperative in SoC integration which needs capable tools that can accommodate… Read More
Author: Pawan Fangaria
Chinese Apple In Trouble – What to look forward?
Xiaomi, an aspirant to top the Smartphone market through its disruptive entry into the maturing mobile phone market with its high quality Smartphones at rock bottom prices is getting roadblocks in its second largest market, India. It surreptitiously entered into today’s top mobile phone market in its home ground, China and in… Read More
Virtual Emulation Extends Debugging Over Physical
Amid burgeoning complexity of SoC verification with ever increasing hardware, software and firmware content, verification engineers are hard pressed with learning multiple tools, technologies and methodologies and still completing SoC verification with full accuracy in time. The complexity, size and diversity of SoC … Read More
What Will Drive Smartphone Market Now?
Whenever a market matures, either it gets plagued by substitutes or it looks for complementary products or technologies which can fuel its maturation curve into further growth opportunities. While PCs and Notebooks got substituted by smartphones, there is no other device in foresight to substitute smartphones. The reason … Read More
HLS – Major Improvement through Generations
I am a believer of continuous improvement in anything we do; it’s pleasant to see rapid innovation in technology these days, especially in semiconductor space – technology, design, tools, methodologies… Imagine a 100K gates up to 1M gates design running at a few hundred MHz frequency and at technology node in the range of .18 to … Read More
Solution for PI, TI & SI Issues in 3D-ICs
As we move towards packing more and more functionalities and increasing densities of SoCs, the power, thermal and signal integrity issues keep on rising. 3D-IC is a great concept to stack multiple dies on top of each other vertically. While it brings lot of avenues to package dies with multiple functions together, it has challenges… Read More
Filling the Gap between Design Planning & Implementation
As every other person is talking about IoT today, Michael Munsey of Dassault Systemes looks at this trend in the context of critical success factors and Dassault’s strategy towards providing semiconductor solution that integrates the design chain and continues to keep the semiconductor eco-system healthy and profitable. … Read More
Predicting Component Temperature Early in Design
In today’s electronics with multiple functions working together, heat generation is on the rise; sometimes it becomes intolerable. In fact components running at different temperatures can cause timing issues, and very high temperatures can lead to operational issues such as latch-up. An electronic system can contain chips,… Read More
What makes the world smart?
The simple answer is when everything in the world is smart. But if you think deeply, you would find that the continuous progression to make things easy in life is what makes the world smarter day-by-day – the sky is the limit. In the world of computing, consider the 17[SUP]th[/SUP] century era when humanbrain was used as a computer … Read More
Not Mobile, Automotive to See Max Semiconductor Growth!
There is no denying that mobile market is almost matured, the growth in the semiconductor industry has to pick up somewhere else. Although it’s expected that worldwide cellphone subscription will exceed the world population in 2015 (already exceeded in many parts of Europe) and continue for some time (while CAGR in unique subscription… Read More
More Headwinds – CHIPS Act Chop? – Chip Equip Re-Shore? Orders Canceled & Fab Delay