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Silicon on insulator (SOI) technology has been around a very long time. I recall five-inch wafers full of SoS (silicon on sapphire) devices while working at the RCA Solid State Technology Center back in the dawn of time. Today, the concept of silicon on insulator is alive and well. Companies like GLOBALFOUNDRIES offer a special … Read More
On September 9 and 10 Altair held their high-performance computing virtual summit. Altair is a company with a large footprint. In their own words, “Altair is a global technology company that provides software and cloud solutions in the areas of data analytics, product development, and high-performance computing (HPC).” Their… Read More
This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. Not all SerDes are the same. The presentation covered here,… Read More
This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. The presentation covered here from Synopsys focuses on the… Read More
Synopsys has released a Technical Bulletin entitled “Parallel-Based PHY IP for Die-to-Die Connectivity”. The piece is authored by Manuel Mota, senior product marketing manager, staff at Synopsys. Manuel has worked at Synopsys for 11 years in the IP area. Prior to that, he worked at MIPS Technologies, Chipidea (acquired… Read More
There’s a lot to keep you awake at night these days. If you live in California, it’s wildfires and unbreathable air. If you live on planet Earth, it’s COVID-19. And if you’re part of the value chain for IoT, it’s the security and robustness of the silicon and software fabric that connects our world. This fabric connects everything,… Read More
We all know the signal integrity and power integrity challenges of high-performance system design. It used to be enough to design a robust chip. Now, the interaction between the chip, the substrate/package and the PCB all matter. If your design is 2.5D, as many are these days, the problems just gets worse. Chiplets are becoming… Read More
Last month, I discussed a webinar about HCL VersionVault – HCL VersionVault Delivers Version Control and More. This webinar introduced the HCL VersionVault product. This post will discuss a new video entitled “How HCL VersionVault Works – Directory Versioning.”
To recap, VersionVault delivers a lot of … Read More
This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. The talk covered here focuses on a complete on-die clock … Read More
TSMC held their very popular Open Innovation Platform event (OIP) on August 25. The event was virtual of course and was packed with great presentations from TSMC’s vast ecosystem. One very interesting and relevant presentation was from Dolphin Design, discussing the delivery of high-performance audio processing using TSMC’s… Read More
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Unlocking the cloud: A new era for post-tapeout flow for semiconductor manufacturing