There’s a lot to unpack in the title of this post. First, Siemens EDA is the new name for Mentor, a Siemens Business. The organization continues to operate as part of Siemens Digital Industries Software. The organization has released a white paper that describes research done with the American University of Armenia. The work examines… Read More
Author: Mike Gianfagna
ESD Alliance Report for Q3 2020 Presents an Upbeat Snapshot That is Up and to the Right
The Electronic System Design (ESD) Alliance (a SEMI Technology Community) recently released their regular report on EDA revenue for Q3, 2020 . While the report is a normal occurrence, the numbers in this particular report are anything but normal. I have been reviewing these reports for many years, and I honestly can’t remember… Read More
Webinar: Rescale is Providing an On-Ramp to the Hybrid Cloud for Chip Design
We all know that design complexity is increasing at a fast pace. There’s always more analysis to run on larger and larger volumes of data. During tapeout, these demands can grow by an order of magnitude. Successful design projects need to add huge amounts of CPU, memory and storage for short bursts of time during tapeout to meet their… Read More
PLDA is at the Leading Edge with Advances in Both PCIe 5.0 and CXL
There are significant advances in communication protocols happening all around us. The Peripheral Component Interconnect Express (PCIe) Gen 5 standard is delivering the needed device-to-device performance to support artificial intelligence and machine learning applications as well as cloud-based workloads. The rapidly… Read More
SmartDV Expands Its Design IP Portfolio with an Acquisition
Back in April, I posted a blog about SmartDV, The Quiet Giant in Verification IP and More. This is a story about the “more” part of that statement. Acquisition activity in the semiconductor sector has been quite brisk this year. A bright spot in what could otherwise be a sometimes-overwhelming series of bad news. Acquisition has … Read More
Analog Bits is Taking the Virtual Holiday Party up a Notch or Two
As 2020 comes to a close, I hear a lot of chatter about virtual meeting fatigue; “I’m Zoomed out”. We’ve all attended virtual versions of conferences this year with various degrees of success. Overall, I have to say these events are getting better. Semiconductor and EDA folks have a way of adapting and inventing, and it’s showing … Read More
NetApp’s FlexGroup Volumes – A Game Changer for EDA Workflows
In my prior post on NetApp, I discussed how the company’s FlexCache technology can keep distributed design teams in sync. Coordination and collaboration are critical elements of any complex design project. The ability to deliver results quickly while managing the massive amounts of data is also a critical element of success.… Read More
Flex Logix Expands Its eFPGA Footprint with a Low Power Comms Design Win from OpenFive
Embedded FPGA use is on the rise. The programmability offered by this kind of IP finds many applications in complex SoCs. There was a recent announcement that OpenFive had licensed Flex Logix’s eFPGA to develop a low power communications SoC. The part required a large eFPGA. The news was reported on SemiWiki here. This announcement… Read More
Silicon Catalyst’s Semi Industry Forum – All-Star Cast Didn’t Disappoint
A few weeks ago I wrote about an upcoming event Silicon Catalyst was hosting, the Semiconductor Industry Forum – A View to the Future. I mentioned a high-profile group of presenters: Don Clark, Contributing Journalist, New York Times as moderator; Mark Edelstone, Chairman of Global Semiconductor Investment Banking, Morgan… Read More
Synopsys is Extending CXL Applications with New IP
Compute Express Link (CXL), a new open interconnect standard, targets intensive workloads for CPUs and purpose-built accelerators where efficient, coherent memory access between a host and device is required. A consortium to enable this new standard is in place, and a lot of heavy hitters are behind the standard, including … Read More
Unlocking the cloud: A new era for post-tapeout flow for semiconductor manufacturing