Over the recent years, the volume and velocity of discussions relating to chiplets have intensified. A major reason for this is the projected market opportunity. According to research firm Omdia, chiplets driven market is expected to be $6B by 2024 from just $645M in 2018. That’s an impressive nine-fold projected increase over… Read More
Author: Kalar Rajendiran
Heterogeneous Chiplets Design and Integration
Chip Design in the Cloud – Annapurna Labs and Altair
The above title refers to a webinar that was hosted by Altair on April 28th. Chip design in the cloud is not a new idea. So, what is the big deal with the above title. Sometimes titles don’t reveal the full story. Annapurna Labs happens to be an Amazon company. It used to be an independent semiconductor company that was acquired by Amazon… Read More
Enhancing RISC-V Vector Extensions to Accelerate Performance on ML Workloads
During the week of April 19th, Linley Group held its Spring Processor Conference 2021. The Linley Group has a reputation for convening excellent conferences. And this year’s spring conference was no exception. There were a number of very informative talks from various companies updating the audience on the latest research and… Read More
Spot-On Dead Reckoning for Indoor Autonomous Robots
One meaning of the word “reckoning” says it is the action or process of calculating or estimating something. But dead reckoning? What does that mean? Believe it or not, we have all deployed dead reckoning to varying degrees of success on different occasions. As an example, when driving on a multi-lane winding highway and direct … Read More
Achronix Next-Gen FPGAs Now Shipping
Earlier in April, Achronix made a product announcement with the headline “Achronix Now Shipping Industry’s Highest Performance Speedster7t FPGA Devices.” The press release drew attention to the fact that the 7nm Speedster®7t AC7t1500 FPGAs have started shipping to customers ahead of schedule. In the complex product world… Read More
Using eFPGA to Dynamically Adapt to Changing Workloads
In early April, Gabriele Saucier kicked off Design & Reuse’s IPSoC Silicon Valley 2021 Conference. IPSoC conference as the name suggests is dedicated to semiconductor intellectual property (IP) and IP-based electronic systems. There were a number of excellent presentations at the conference. The presentations had been… Read More
Die-to-Die Interface PHY and Controller Subsystem for Next Generation Chiplets
In early April, Gabriele Saucier kicked off Design & Reuse’s IPSoC Silicon Valley 2021 Conference. IPSoC conference as the name suggests is dedicated to semiconductor intellectual property (IP) and IP-based electronic systems. There were a number of excellent presentations at the conference. The presentations had been… Read More
Enabling Next Generation Silicon In Package Products
In early April, Gabriele Saucier kicked off Design & Reuse’s IPSoC Silicon Valley 2021 Conference. IPSoC conference as the name suggests is dedicated to semiconductor intellectual property (IP) and IP-based electronic systems. There were a number of excellent presentations at the conference. The presentations had been… Read More
VersionVault EDA Integration: A Differentiated Value Solution
HCL Technologies is a large, well-established multi-national company with an annual revenue of around $10B and worldwide employee count of well over 150K. They provide valuable solutions to about 20 different industries and related market segments. Over the years, I have had first hand insights to their semiconductor design… Read More
Library Characterization: A Siemens Cloud Solution using AWS
Pressing demands on compute speeds, storage capacity and rapid access to data are not new to the semiconductor industry. A desire for access to on-demand computing resources have always been there. During pre-cloud-computing era, companies provisioned on-demand compute capacity by procuring high performance computing … Read More
Micron- “The first cut isn’t the deepest”- Chops production & forecast further