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For those taking a quick look at the various MIPI Interface specification, the first reaction is to realize that they will have to look at MIPI more closely, and that it will take them longer than expected to make sure they really understand the various specifications! Let’s start with the PHY. One specification defines the D-PHY,… Read More
Trying to trace DSP birth as a standard IC product, you come back to the early 80’s, when a certain Computer manufacturer named IBM has asked to a certain Semi-Conductor giant (at that time) named Texas Instruments if they could turn a lab concept, Digital Signal Processor, into a standard product that IBM could buy to TI, like they… Read More
Application Processor SoC integrates more and more functions, generation after generation, challenging performance, cost, power efficiency, reliability, and time-to-market. But the maximum die size can’t increase, at least because of the constraints linked with wafer production, manufacturability, yield and finally… Read More
Do you think this figure will go down? Considering the massive move to Mobile equipment, pushing to de-localize your storage medium to instead use the cloud capabilities, and looking at the huge number of people buying smartphone and tablet in emerging countries, no doubt that Data Center related energy consumption is expected… Read More
This is not a theoretical question. Imagine that you are developing and selling digital IP, like Interface Controller, PCI Express or USB 2.0 or 3.0, or MIPI Camera Serial Interface (CSI) or Display Serial Interface (DSI). If you look at companies like Synopsys, they have built their success on the “Integrated Interface IP” concept.… Read More
Until recently, talking about smartphone incredible shipment growth was understood as shipments of A5 iPhone or Galaxy Note, and this was true. Devices priced at $500 or more are shipping like baguette in Paris, but this fact is only true in Europe, Korea, Japan or USA. Does that means that people living populated countries like… Read More
Grenoble is French city well-known within the Semiconductor industry to be one of the last location counting wafer fabs, not only in France but in fact in Europe. Back in the 70’s, under French government impulse, through the Commisariat à l’Energie Atomique (CEA) and the LETI subsidiary in charge of Electronic related research,… Read More
Once upon a time, ASIC designers involved in Processor design, like I was, for the first time in 1987 for Thomson CSF and again in 1994 for Texas Instruments, at that time supporting height (8) ASIC designed by another French company, the Advanced Computer Research Institute (ACRI), had to re-invent the wheel almost every day. When… Read More
If you have attended DAC in Austin (June 2-5), you probably have missed the first TSMC Technology Symposium. It was held on June 6 in Shanghai. Considering my own experience of a 29 hours trip to come back home (in France), I doubt that it was any possible to leave Austin on June 5 to attend TSMC Technology Symposium in Shanghai on June… Read More
I have mentioned NoC adoption explosion during the last two years, illustrated by the huge revenue growth of Arteris. This trend is now confirmed in the fastest moving segments, the Application Processors (AP) and LTE Modem for mobile applications. In fact, Arteris FlexNoC has been integrated in the majority of AP and LTE Modem… Read More
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More Headwinds – CHIPS Act Chop? – Chip Equip Re-Shore? Orders Canceled & Fab Delay