The semiconductor industry is rapidly moving beyond traditional 2D packaging, embracing technologies such as 3D integrated circuits (3D ICs) and 2.5D advanced packaging. These approaches combine heterogeneous chiplets, silicon interposers, and complex multi-layer routing to achieve higher performance and integration.… Read More





AI Booming is Fueling Interface IP 23.5% YoY Growth
AI explosion is clearly driving semi-industry since 2020. AI processing, based on GPU, need to be as powerful as possible, but a system will reach optimum only if it can rely on top interconnects. The various sub-system need to be interconnected with ever more bandwidth and lower latency, creating the need for ever advanced protocol… Read More
Building Trust in Generative AI
AI technology was prevalent at DAC 2025, but can we really trust what Generative AI (GenAI) is producing? Vishal Moondhra, VP of Solutions Engineering from Perforce talked about this topic in the Exhibitor Forum on Monday, so I got a front row seat to learn more.
Vishal started out by introducing the four challenges and risks of using… Read More
Podcast EP296: How Agentic and Autonomous Systems Make Scientists More Productive with SanboxAQ’s Tiffany Callahan
Dan is joined by Dr. Tiffany Callahan from SandboxAQ. As one of the early movers in the evolving sciences of computational biology, machine learning and artificial intelligence, Tiffany serves as the technical lead for agentic and autonomous systems at SandboxAQ. She has authored over 50 peer-reviewed publications, launched… Read More
Insider Opinions on AI in EDA. Accellera Panel at DAC
In AI it is easy to be distracted by hype and miss the real advances in technology and adoption that are making a difference today. Accellera hosted a panel at DAC on just this topic, moderated by Dan Nenni (Mr. SemiWiki). Panelists were: Chuck Alpert, Cadence’s AI Fellow driving cross-functional Agentic AI solutions throughout… Read More
Revolutionizing Simulation Turnaround: How Siemens’ SmartCompile Transforms SoC Verification
In the race to deliver ever-larger SoCs under shrinking schedules, simulation is becoming a bottleneck. With debug cycles constrained by long iteration times—even for minor code changes—teams are finding traditional flows too rigid and slow. The problem is further magnified in continuous integration and continuous deployment… Read More
Arteris Simplifies Design Reuse with Magillem Packaging
Many know Arteris as the “network-on-chip”, or NoC, company. Through acquisitions and forward-looking development, the footprint for Arteris has grown beyond smart interconnect IP. At DAC this year, Arteris highlighted its latest expansion with a new SoC integration automation product called Magillem Packaging. The announcement… Read More
MEMS Technology – From Fringe to Mainstream
Last month, Lj Ristic delivered an invited talk on MEMS technology as a driving force at the Laser Display and Lighting Conference 2025, held at Trinity College Dublin. His talk included a review of some major successes of MEMS industry. We used that occasion to talk to him and discuss some major achievements and the status of MEMS… Read More
Caspia Focuses Security Requirements at DAC
As expected, security was a big topic at DAC this year. The growth of AI has demanded complex, purpose-built semiconductors to run ever-increasing workloads. AI has helped to design those complex chips more efficiently and with less power demands. There was a lot of discussion on these topics. But there is another part of this trend.… Read More
CEO Interview with Peter L. Levin of Amida
Peter L. Levin has served at senior levels of leadership in the federal government, the private sector, and academe. Immediately prior to co-founding Amida, he was Senior Advisor to the Secretary and Chief Technology Officer of the Department of Veterans Affairs, where he led their health record modernization initiative. His… Read More
Facing the Quantum Nature of EUV Lithography