We live in an exploding AI world, and this has put pressure on foundries to deliver new products faster than ever before. Any help to accelerate the semiconductor R&D goes a long way to make the life of Fab engineers easier. EDA tools in the TCAD (Technology Computer Aided Design) category are critical for TCAD engineers to accelerating… Read More
Emulator-Like Simulation Acceleration on GPUs. Innovation in VerificationGPUs have been proposed before to accelerate logic…Read More
Pioneering Edge AI: TekStart's Cognitum Processor Ushers in a New Era of Efficient IntelligenceOne of the more in interesting companies I…Read More
CAST Simplifies RISC-V Embedded Processor IP Adoption with New Catalyst ProgramIn a move poised to accelerate the integration…Read MoreSynopsys and NVIDIA Forge AI Powered Future for Chip Design and Multiphysics Simulation
In a landmark announcement at NVIDIA’s GTC Washington, D.C. conference Synopsys unveiled deepened collaborations with NVIDIA to revolutionize semiconductor design and engineering through agentic AI, GPU-accelerated computing, and AI-driven physics simulations. This partnership, building on over three decades… Read More
IEDM 2025 and the 100th Anniversary of the FET
The International Electron Devices Meeting (IEDM) is the world’s preeminent forum for unveiling breakthroughs in semiconductor and electronic device technology, manufacturing, design, physics, modeling, and circuit integration. Sponsored by the IEEE Electron Devices Society, it has been a cornerstone event since… Read More
CEO Interview with Wilfred Gomes of Mueon Corporation
Wilfred Gomes is the co-founder, CEO, and president of Mueon Corporation, a next-generation infrastructure startup rethinking how data centers are built for the AI era. The company’s flagship innovation, Cubelets™, modular, stackable units that unite compute, memory, power delivery and thermal management, replace the … Read More
Podcast EP315: The Journey to Multi-Die and Chiplet Design with Robert Kruger of Synopsys
Daniel is joined by Robert Kruger, product management director at Synopsys, where he oversees IP solutions for multi-die designs, including 2D, 3D, and 3.5D topologies. Throughout his career, Robert has held key roles in product marketing, business development, and roadmap planning at leading companies such as Intel, Broadcom,… Read More
Intel to Compete with Broadcom and Marvell in the Lucrative ASIC Business
The second chapter of our book “Fabless: The Transformation of Semiconductor Industry” describes the ASIC business and how important it is. That was more than 10 years ago and the ASIC business is still at the forefront of the Semiconductor industry and is a key enabler of the AI revolution we are experiencing today.
First let’s … Read More
Quadric: Revolutionizing Edge AI
In the rapidly evolving landscape of AI, Quadric stands out as a pioneering force in edge computing. Founded in 2018 and headquartered in Burlingame, California, Quadric is a technology company focused on developing high-performance, energy-efficient processors for AI workloads at the edge devices like smartphones, IoT … Read More
Why IP Quality and Governance Are Essential in Modern Chip Design
By Kamal Khan
In today’s semiconductor industry, success hinges not only on innovation but also on discipline in managing complexity. Every system-on-chip (SoC) is built from hundreds of reusable IP blocks—standard cells, memories, interfaces, and analog components. These IPs are the foundation of the design. But if the foundation… Read More
U.S. Electronics Production Growing
U.S. electronics production has been on an accelerating growth trend over the last ten months. Three-month average change versus a year ago (3/12 change) has increased from 0.4% in October 2024 to 6.2% in August 2025. Japan’s 3/12 change has been positive since November 2024, but has been decelerating for most of 2025, reaching… Read More
Failure Prevention with Real-Time Health Monitoring: A proteanTecs Innovation
In the complex world of semiconductors, reliability, availability, and serviceability (RAS) have become paramount, especially as devices shrink to nanoscale geometries like 2nm. At the recent 2025 TSMC OIP Forum Noam Brousard, VP of Solutions Engineering at proteanTecs, presented “Failure Prevention with Real-Time… Read More




			
			
			
			
			
			
			
			
Intel to Compete with Broadcom and Marvell in the Lucrative ASIC Business