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Recent Semiconductor IP Wikis
ESUN Wikiby Daniel Nenni on 10-04-2026 at 6:49 pm
Overview
ESUN is an Open Compute Project (OCP) Networking workstream adapting Ethernet for tightly coupled AI accelerators. It targets efficient framing, resilient links, and lossless forwarding across single-hop and multi-hop fabrics. It coordinates with IEEE and the Ultra Ethernet Consortium (UEC). [1]
The Network Operator… Read More
UALink Wikiby Daniel Nenni on 10-04-2026 at 5:47 pm
Overview
UALink is a consortium-defined scale-up interconnect for AI accelerators. Its memory-oriented fabric connects accelerators through switches inside a computing pod. The 200G 1.0 baseline specifies 200 Gb/s per lane and addressing for as many as 1,024 accelerators. [1]
Scale-up fabrics support closely coupled computation;… Read More
UCIe 3.0 Wikiby Daniel Nenni on 08-21-2025 at 8:47 am
UCIe 3.0 is the third major revision of the open, die-to-die interconnect standard for chiplets inside a package. Announced August 5, 2025, UCIe 3.0 doubles peak link speed over 2.0—introducing 48 GT/s and 64 GT/s modes—while adding manageability, power-efficiency, and reliability features aimed at scaling multi-die systems… Read More
DDR Wikiby Daniel Nenni on 08-18-2025 at 10:14 am
Quick definition
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DDR (Double Data Rate SDRAM): Mainstream dynamic memory for desktops, workstations, and servers. Uses pluggable modules (DIMMs/SO-DIMMs), wide channels, high capacities, and motherboard-friendly signaling.
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LPDDR (Low-Power DDR): DRAM family optimized for mobile, embedded, and thin/edge devices.
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Read More
LPDDR Wikiby Daniel Nenni on 08-18-2025 at 10:06 am
LPDDR (Low-Power Double Data Rate) is a family of DRAM standards from JEDEC optimized for mobile and embedded systems where energy efficiency, thin form factors, and thermals matter as much as raw bandwidth. LPDDR trades the very highest peak performance and capacity of desktop/server DDR for lower I/O voltages, aggressive … Read More
GPMI (General-Purpose Media Interface) is a NAND-flash controller IP block found in several NXP/Freescale i.MX application processors (e.g., i.MX23/i.MX28/i.MX6 variants). It offloads low-level NAND signaling, integrates tightly with a hardware BCH error-correction engine, and streams data through a DMA engine to system… Read More
Name: Tesla Dojo D1 Chip
Designed by: Tesla, Inc.
Announced: August 19, 2021 (AI Day)
First Deployment: 2023 (pilot systems), with full-scale training racks in 2024–2025
Fabricated by: TSMC
Process Node: N7 (D1 generation); future iterations expected on 5nm or 3nm
Use Case: Neural network training for autonomous vehicles and… Read More
UCIe (Universal Chiplet Interconnect Express) is an open industry standard for die-to-die interconnects that enables high-bandwidth, low-latency, power-efficient communication between chiplets in advanced package architectures. The UCIe specification was launched in March 2022 by the UCIe Consortium, with founding… Read More
The silent killer of analog reliability: Why SPICE misses floating net