Wiki Tag: Backside Power Delivery
Intel 3 vs. Intel 18A Wiki
Overview
| Feature | Intel 3 | Intel 18A |
|---|---|---|
| Node Class | Enhanced 7nm (refinement of Intel 4) | 1.8nm-class full-node leap |
| Transistor Type | FinFET | RibbonFET (GAAFET) |
| Power Delivery | Front-side power only | Backside Power Delivery (PowerVia) |
| EUV Use | Partial (select layers) | Extensive EUV, reduced multi-patterning |
| PPA Target | Modest vs. Intel |
Intel Backside Power Delivery (PowerVia) Wiki
Name: PowerVia™
Type: Backside Power Delivery Network (BSPDN)
Developer: Intel Corporation
First Production Node: Intel 20A (2nm-class)
Announced: July 2021
Expected Production Deployment: 2024 (Intel 20A), with high-volume in 2025
Successor Technologies: Integrated with RibbonFET (Intel’s Gate-All-Around)
Competes… Read More
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