webinar Archives - Page 8 of 25

Webinar: ISO-26262 Compliant BMS and Vehicle Integration

Webinar: ISO-26262 Compliant BMS and Vehicle Integration
by Admin on 07-23-2024 at 8:45 pm

This webinar covers how Ansys solutions address battery management challenges and complexities: model-based functional safety analysis and safety-critical BMS software development, BMS integration, and validation.

TIME:
JULY 31, 2024
9 AM EDT

Venue:
Virtual

Overview

A reliable and safe battery design requires a battery

Failure and Yield Analysis

Failure and Yield Analysis
by Admin on 07-23-2024 at 7:05 pm

Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand… Read More

Wafer Fab Processing

Wafer Fab Processing
by Admin on 07-23-2024 at 7:04 pm

Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today’s wafer fab contains some of the most complex and intricate… Read More

Defect-Based Testing

Defect-Based Testing
by Admin on 07-23-2024 at 7:02 pm

Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today’s application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on the stuck-at-fault (SAF) to model defect behavior. Unfortunately, the SAF… Read More

Packaging Failure and Yield Analysis

Packaging Failure and Yield Analysis
by Admin on 07-23-2024 at 7:01 pm

Webinar: IC Packaging Technology

Webinar: IC Packaging Technology
by Admin on 07-23-2024 at 6:58 pm

Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal

Webinar: Advanced CMOS/FinFET Fabrication

Webinar: Advanced CMOS/FinFET Fabrication
by Admin on 07-23-2024 at 6:56 pm

Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today’s microprocessor chips have one thousand times the processing power of those a decade ago. These challenges have been accomplished because of the integrated circuit industry’s ability to track something… Read More

Webinar: Semiconductor Reliability and Product Qualification

Webinar: Semiconductor Reliability and Product Qualification
by Admin on 07-23-2024 at 6:55 pm

Package reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability… Read More

July 3, 2024July 10, 2024

LIVE WEBINAR Maximizing SoC Energy Efficiency: The Role of Realistic Workloads and Massively Parallel Power Analysis

LIVE WEBINAR Maximizing SoC Energy Efficiency: The Role of Realistic Workloads and Massively Parallel Power Analysis
by Daniel Nenni on 07-03-2024 at 2:00 pm
Categories: EDA, Emulation, Events, Synopsys

As the complexity of modern System-on-Chip (SoC) designs continues to rise, achieving energy efficiency measured as performance per watt has become a crucial design goal. With the increasing demand for powerful, multifunctional chips, balancing performance with power consumption has become essential. Realistic workloads… Read More

Webinar: Enhancing Manufacturing Test Flows with Synopsys VC Z01X

Webinar: Enhancing Manufacturing Test Flows with Synopsys VC Z01X
by Admin on 06-26-2024 at 1:44 pm

Leveraging functional patterns is crucial for achieving high defect coverage and reducing defective parts per million (DPPM) levels. Synopsys VC Z01X fault simulator offers enhanced fault coverage in manufacturing test flows, complementing ATPG tools like Synopsys TestMAX ATPG. In this presentation we will delve into