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There has been a lot of discussion on SemiWiki lately around 14nm FinFET technology and who really leads and by how much. I thought it would be interesting to review some process metrics for previous technology generation and then make some forecasts around 10nm.
The focus of this article will be Intel, TSMC and Global Foundries/Samsung… Read More
ARM ♥ Xilinx!by Daniel Nenni on 09-28-2014 at 7:00 amCategories: Arm, FPGA, IP, Xilinx
The good news is that as a part of SemiWiki we get free media passes to all of the cool conferences. The bad news is that our inboxes get flooded with announcements. ARM TechCon is next week and my delete button is on overtime but it is interesting to see who is active in conferences and who is not. In this case Xilinx is very active and Altera… Read More
Mentor at TSMC OIP, 16nm, and 10nmby Beth Martin on 09-26-2014 at 4:46 pmCategories: Siemens EDA
On Tuesday, September 30, TSMC hosts another Open Innovation Platform Ecosystem forum at the San Jose Convention Center. Have you registered? This year includes 30 technical sessions from TSMC’s ecosystem partners, divided into three separate tracks. I’ll be hanging out in the EDA track, listening to various takes on 16nm FinFET… Read More
Right on cue, TSMC announces 16nm FinFET production silicon. I believe this is the original version of FinFET versus 16FF+ which is due out in 1H 2015. I will confirm this next week at the TSMC OIP event in San Jose, absolutely. Either way this is excellent news for the fabless semiconductor ecosystem and I look forward to the first … Read More
Fortunately Paul McLellan and I missed IDF. Paul was atop Mt. Kilimanjaro and I was in Taiwan signing books. After reviewing the materials and watching the videos we really didn’t miss much in regards to mobile so no regrets. The Apple event would have been fun even though I won’t be buying an iPhone6 or an iWatch and I will tell you why.… Read More
Process shrinks, which have served us well for most of the Moore’s Law journey, are reaching their limits. For switching transistors, the biggest problems of leakage current and gate oxide vulnerability in planar MOSFETs have led the industry to new 3D microstructures such as FinFET. For non-volatile memory, the problem is generally… Read More
It’s that time of year again! The 4th TSMC Open Innovation Platform Ecosystem Forum is coming up on September 30th. As usual it is in the San Jose conference center. The TSMC OIP Ecosystem Forum brings together TSMC’s design ecosystem companies and their customers to share real case solutions to today’s design challenges.… Read More
The nice thing about webinars is that if you register for the live one and you can’t attend you will still get first notice when the replay goes up. The other nice thing is that you can read a blog review of a webinar or whitepaper on SemiWiki first to see if it is worth your time. If you do attend a webinar you can also post a review of… Read More
For several years now, TSMC has run increasingly sophisticated IP validation. Ramping a new process as a foundry requires a number of things to all come together almost simultaneously: the process, of course, and some designs to run and start to recover the huge capital investment a modern fab entails. With many SoCs having over… Read More
Last month Cadenceannounced its fastest parasitic extraction tool (minimum 5 times better performance compared to other available tools) which can handle growing design sizes with interconnect explosion, number of parasitics and complexities at advanced process nodes including FinFETs, without impacting accuracy of … Read More