TSMC Will Own the Internet of Things!

TSMC Will Own the Internet of Things!
by Daniel Nenni on 04-27-2014 at 8:00 am

In my quest to uncover the future of the semiconductor industry I was quite impressed by the executive presentations at the TSMC Symposium last week. Rick Cassidy opened the 20[SUP]th[/SUP] Annual TSMC Technology Symposium followed by Dr. Mark Liu, Dr. Jack Sun, Dr. Cliff Hou, J.K Wang, Dr. V.J. Wu, and Suk Lee. A variety of topics… Read More


Dr. Morris Chang: A Conversation with the Chairman

Dr. Morris Chang: A Conversation with the Chairman
by Daniel Nenni on 04-24-2014 at 10:00 pm

There are moments in one’s career that are memorable beyond others, and last night was one of those moments for me, absolutely:

Stanford University President John L. Hennessy will lead a discussion with Stanford Engineering Hero Morris Chang, an innovator and entrepreneur who revolutionized the semiconductor industry by creatingRead More


Strong 2014 for Semiconductor Equipment and CapEx

Strong 2014 for Semiconductor Equipment and CapEx
by Bill Jewell on 04-24-2014 at 9:00 pm

Spending on semiconductor manufacturing equipment is headed for healthy growth in 2014. The latest data from SEMI and the Semiconductor Equipment Association of Japan (SEAJ) shows March 2014 three-month-average billings for semiconductor manufacturing equipment were up 16% from February 2014 and up 31% from a year ago. Bookings… Read More


U2U: Things You Might Not Know About TSMC

U2U: Things You Might Not Know About TSMC
by Paul McLellan on 04-10-2014 at 10:50 pm

At Mentor’s U2U this afternoon I attended a presentation on TSMC’s use of Calibre PERC (it is a programmable electrical rule checker) for qualification of IP in TSMC’s IP9000 program. I’ve written about this before here. Basically IP providers at N20SOC, N16FF, and below are required to use PERC to guarantee… Read More


Advancements in Nanoscale Manufacturing

Advancements in Nanoscale Manufacturing
by Paul McLellan on 04-10-2014 at 1:40 pm

I’m at the GSA Silicon Summit today, at the computer history museum. The first panel session this morning was about future process technology. It was moderated by Joe Sawicki of Mentor with a panel consisting of Rob Aitken from ARM, Paul Farrar of G450C, Peter Huang of TSMC, John Kibarian of PDF Solutions and someone from Applied… Read More


What is Next for GLOBALFOUNDRIES?

What is Next for GLOBALFOUNDRIES?
by Daniel Nenni on 04-04-2014 at 8:30 am

In response to changing industry dynamics, AMD announced in October 2008 a new strategy to focus exclusively on the design phase of semiconductor product development. To achieve that strategy, AMD partnered with Advanced Technology Investment Company (ATIC) of Abu Dhabi to create a new joint venture company designed to become… Read More


FinFET Custom Design

FinFET Custom Design
by Paul McLellan on 04-02-2014 at 8:30 pm

At CDNLive, Bob Mullen of TSMC gave a presentation on their new custom FinFET flow, doing design, and verifying designs. At 16nm there are all sorts of relatively new verification problems such as layout dependent effects (LDE) and voltage dependent design rules. We had some of this at 20nm but like most things in semiconductor,… Read More


The Infamous Intel FPGA Slide!

The Infamous Intel FPGA Slide!
by Daniel Nenni on 03-11-2014 at 10:30 am

As I have mentioned before, I’m part of the Coleman Research Group so you can rent me by the hour to better understand the semiconductor industry. Most of the conversations are by phone but sometimes I do travel to the East Coast, Taiwan, Hong Kong, and China for face-to-face meetings. Generally the calls are the result of an event … Read More


Getting an MPW Quote on My iPhone

Getting an MPW Quote on My iPhone
by Paul McLellan on 02-25-2014 at 12:00 pm

As I blogged about recently, eSilicon have completely automated the quote process for their MPW shuttle service. You can use an online interface that runs in the browser but there is also an app that you can download from the App Store.

So I decided I had a few million dollars to burn and I’d get myself my very own TSMC 20nm parts.… Read More


Dr. Cliff Hou, TSMC VP of R&D, Keynote

Dr. Cliff Hou, TSMC VP of R&D, Keynote
by Daniel Nenni on 02-16-2014 at 9:00 am

This will be my 30[SUP]th[/SUP] Design Automation Conference. I know this because my first DAC was the same year I got married and forgetting how many years you have been married can cost you half your stuff. I have known Cliff Hou for half of that time and he has proven to be one of the most humble and honorable men I have worked with, definitely.… Read More