At the TSMC Technology Symposium last month Suk Lee presented a lot of information on design enablement. Suk is an interesting guy with a unique background in ASIC, Semiconductor, EDA, and now Foundry. In baseball terms that would be like playing infield, outfield, home plate, and umpire!
Around the turn of the millennium Suk actually… Read More
Last week was the Linley Mobile Conference. Mobile is a huge semiconductor market and, outside of Intel, is the main driver for next generation process technologies. A new generation of mobile phones comes along, fills the leading edge fabs for a year or two and then moves on to the next generation. Nothing comes close to requiring… Read More
Semiconductor industry capital expenditures (capex) in 2015 are expected to be $69 billion in 2015, up 6% from $65 billion in 2014 according to IC Insights. We at Semiconductor Intelligence have compiled 2015 capex outlook by company. The major memory companies account for 38% of 2015 capex and the major foundries account for … Read More
It’s true that Japan was once the center of semiconductor business and we were carrying on with that perception until recently. In 1990, six out of top10 semiconductor companies (excluding pure-play foundries) were in Japan; and 59% of worldwide semiconductor market was concentrated with the top10 companies. The semiconductor… Read More
In the third installment of this series we discussed the status of DRAM scaling and Moore’s law. In this installment we will tackle logic. The focus will be on foundry logic.
Logic technology challenges
In the second installment of this series we discussed constant electric field scaling. As we mentioned in that installment at … Read More
Intel Inline with lowered numbers- 2015 Revs to be Flat…
Capex Slashed by 13% to $8.7B- 10nm at risk???
Mortgaging the future???
Is the foundry business dead???
Desperately seeking growth!!!
Intel Inline…
Intel reported revenues of $12.8B and EPS of $0.41 in line with downward revised estimates after chopping $1B… Read More
In 2001, flipchip with solder bump was already a dominant technology and it was replacing wire bonding as the main interconnection choice for a growing number of devices. It was offering fine pitch interconnections for increased I/O counts. In the solder bump process, a bump is formed on the chip and on the package substrate and … Read More
The way we are seeing technology progression these days is unprecedented. It’s just about six months ago, I had written about the intense collaboration between ANSYSand TSMCon the 16nm FinFET based design flow and TSMC certifying ANSYS tools for TSMC 16nm FF+ technology and also conferring ANSYS with “Partner of the Year” award.… Read More
Today was TSMC’s 2015 North American Technology Symposium. They talked about a lot of things but perhaps the most important was that they gave a lot of details of new processes, new fabs, and volume ramps.… Read More
Last year in November when I looked at the world’s top20 semiconductor companies with Samsungand TSMCbeing at the second and third rank respectively, first being Intel, I computed the sales numbers of the companies based on their countries and found that Taiwan and South Korea accounted for 34.5% of the total sales of the top20 … Read More
