Foundry CAPEX Jumped from 17% to 37% of LAM Business

Foundry CAPEX Jumped from 17% to 37% of LAM Business
by Robert Maire on 10-23-2016 at 4:00 pm

Lam- in line qtr but guides above street over near term. As with ASML, foundry is driver with subdued memory, The Math implies biz peaking-Looking for DRAM in 2017.

Lam reported another great, record quarter, more or less in line with expectations with revenues coming in at $1.632B and shipments of $1.708B, generating EPS of $1.81.… Read More


What is the impact of missing the 7NM node with EUV?

What is the impact of missing the 7NM node with EUV?
by Robert Maire on 10-23-2016 at 12:00 pm

ASML reported a quarter that was slightly below expectations coming in at Euro 1.815B in revenues and Euro 0.93 EPS. Orders were a bit soft at Euro 1.4B but well within the normal quarterly variation of a lumpy business. Euro 28M was lost in a currency adjustment associated with the Hermes acquisition.

The guidance for Q4 was between… Read More


Webinar Offers View into TSMC IP Design Methodology

Webinar Offers View into TSMC IP Design Methodology
by Tom Simon on 10-21-2016 at 12:00 pm

Standard cell and memory IP are key enablers for new process node availability. These two items must be in place early and be completely ready for a process node to scale to volume. Development of both leaves no room for error and they require the highest performance possible. Foundries are extremely focused on this and spend a lot… Read More


CEO Interview: Geoff Tate of Flex Logix

CEO Interview: Geoff Tate of Flex Logix
by Daniel Nenni on 10-10-2016 at 7:00 am

Geoff Tate Flexlogix

This is the second in series of interviews we will do with executives inside the fabless semiconductor ecosystem. Geoff Tate was the founding CEO of Rambus and is now CEO and co-founder of Flex Logix (embedded FPGA). This one should be of great interest due to the recent $16.7B acquisition of Altera by Intel. We all now know the importance… Read More


16nm HBM Implementation Presentation Highlights CoWoS During TSMC’s OIP

16nm HBM Implementation Presentation Highlights CoWoS During TSMC’s OIP
by Tom Simon on 09-29-2016 at 12:00 pm

Once a year, during the TSMC’s Open Innovation Platform (OIP) Forum you can expect to see cutting edge technical achievements by TSMC and their partners. This year was no exception, with Open-Silicon presenting its accomplishments in implementing an HBM reference design in 16nm. It’s well understood that HBM offers huge benefits… Read More


ESL Architectural Power Estimation Support from TSMC — yes, TSMC

ESL Architectural Power Estimation Support from TSMC — yes, TSMC
by Tom Dillinger on 09-22-2016 at 11:00 am

Electronic system level (ESL) modeling for system architecture exploration is rapidly gaining momentum. The simulation performance requirements for hardware/software co-design are demanding — an abstract model for SoC IP cores is required. Typically, soft IP will include a number of model configuration parameters.… Read More


TSMC and Solido to Share Experiences with Managing Variation in Webinar

TSMC and Solido to Share Experiences with Managing Variation in Webinar
by Tom Simon on 09-10-2016 at 7:00 am

TSMC knows better than anyone the effect that variation can have at advanced process nodes. Particularly in memory designs and in standard cell designs, variation has become a very critical because of its effects on yield and because of the high-cost of compensating for it. Smaller feature sizes combined with lower voltage thresholds… Read More


The 2016 Leading Edge Semiconductor Landscape

The 2016 Leading Edge Semiconductor Landscape
by Scotten Jones on 09-03-2016 at 7:00 am

The leading edge semiconductor logic landscape has in recent years collapsed to just four companies. The following is a summary of what is currently known about each company’s plans and how they compare. ASML has analyzed many logic nodes and developed a formula that normalizes processes to a “standard node”.… Read More


Pushing automotive-grade embedded flash to 28nm

Pushing automotive-grade embedded flash to 28nm
by Don Dingee on 09-02-2016 at 4:00 pm

18 months ago Renesas announced they were prototyping their SG-MONOS eFlash on 28nm, and at the time we said it would be a couple of years before actual product. Yesterday, Renesas revealed their partner in this effort is TSMC – no surprise – and hinted things are moving, with better performance than expected but on a longer qualification… Read More


Flex Logix validating EFLX on TSMC 40ULP

Flex Logix validating EFLX on TSMC 40ULP
by Don Dingee on 08-29-2016 at 4:00 pm

Flex Logix has been heads-down for the last several months working toward customer implementations of their EFLX reconfigurable RTL IP cores. Today, they’ve announced a family of 10 hard IP cores ready in TSMC 40ULP, and provided an update to their roadmap for us.… Read More