Although the rejection of the Lattice deal was expected, it none the less has an impact on a number of dynamics in the chip industry and further M&A and consolidation. Freezing out China removes a “catalyst” in the market which help bid up values and add fear to both potential targets or those left out. Cross border… Read More
Tag: tsmc
TSMC OIP and the Insatiable Computing Trend!
This year’s OIP was much more lighthearted than I remember which is understandable. TSMC is executing flawlessly, delivering new process technology every year. Last year’s opening speaker, David Keller, used the phrase “Celebrate the way we collaborate” which served as the theme for the conference. This year David’s… Read More
Can the iPhone rollout lift the industry?
We are in the midst of a number of cross currents buffeting the industry. The Korea risk seems to have escalated again and our government has thrown fuel on the fire by threatening trade agreements at the most inopportune timing possible. However we are also a week away from the roll out of one of the most anticipated Iphones ever which… Read More
Breakfast with Aart de Geus and the Foundries!
Being the number one EDA and the number one IP company does have its advantages and the resulting foundry relationships are a clear example. One of the DAC traditions that I truly enjoy is the Synopsys foundry breakfasts. Not only does Synopsys welcome scribes, they reserve a table up front for us and Synopsys CEO Aart de Geus has been… Read More
Apple iPhone Super Cycle Update!
In 2014 Apple released the iPhone 6 which included the first SoC built on a TSMC (20nm) process. This phone started what many call a “Super Cycle” of people upgrading. According to Apple, they now have more than 1 billion activated devices so this super cycle could be seriously super, absolutely.… Read More
High Bandwidth Memory ASIC SiPs for Advanced Products!
When someone says, “2.5D packaging” my first thought is TSMC and my second thought is Herb Reiter. Herb has more than 40 years of semiconductor experience and he has been a tireless promoter of 2.5D packaging for many years. Herb writes for and works with industry organizations on 2.5D work groups and events at conferences… Read More
TSMC OIP Ecosystem Forum 2017 Preview!
The TSMC OIP Ecosystem Forum is upon us again. I have yet to meet a disappointed attendee so it is definitely worth your time: Networking with more than 1,000 semiconductor professionals, the food, mingling with the 50+ EDA, IP, and Services Companies, the food, and of course the content. The 7nm and 7nm EUV updates alone are worth… Read More
AI ASICs Exposed!
Artificial intelligence, or AI is really heating up these days. The technology has been around for decades, but of late it is becoming quite a focus for applications such as data center analytics, autonomous vehicles and augmented reality. Why the rebirth? The trend appears to be driven by two forces – availability of data to train… Read More
Samsung Sloppy Sailor Spending Spree!
Last week, TEL (which is the Japanese equivalent to AMAT & LRCX) reported a June quarter which saw revenues drop to 236B Yen from March’s 261B Yen and saw earnings drop from March’s 47B Yen to June’s 41B Yen, a respective 9.3% decrease and a 12.8% decrease in earnings.
We don’t think this is attributable… Read More
Semicap Thoughts: ASML AMAT INTEL SAMSUNG TSMC MICRON
ASML reported results in line and slightly ahead of expectations which helped push ASML and the other semicap stocks back to their original valuations prior to the two step pull back that lasted about a month. We are now back to relatively high, record valuations not seen or ever seen previously (at least for a long time) by many companies.… Read More