The 2017 Leading Edge Semiconductor Landscape

The 2017 Leading Edge Semiconductor Landscape
by Scotten Jones on 12-27-2016 at 6:00 pm

In early September of 2016 I published an article “The 2016 Leading Edge Semiconductor Landscape” that proved to be very popular with many views, comments and reposting’s. Since I wrote that article a lot of new data has become available enabling some projections to be replaced by actual values and new analysis… Read More


Advanced Semiconductor Process Cost Trends

Advanced Semiconductor Process Cost Trends
by Scotten Jones on 12-13-2016 at 4:00 pm

The cost trend for leading edge semiconductor technologies is a subject of some controversy in the industry. Cost is a complex issue with many interacting factors and much of the information out in the industry is in my opinion misleading or incorrect. In this article, I will discuss each of the factors as well as present a view of … Read More


AMAT LRCX and EUV Economics

AMAT LRCX and EUV Economics
by Robert Maire on 11-23-2016 at 7:00 am

Lam & Applied talked about “sustainable” growth Both expect share gains & growth in a flattish market. We examine the “new, lower, cyclicality”. Although Applied and Lam are fierce competitors , coming at things from different directions, they sounded awfully similar last week.
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IP-SoC 2016: IP Innovation, Foundries, IoT and Security

IP-SoC 2016: IP Innovation, Foundries, IoT and Security
by Eric Esteve on 11-10-2016 at 7:00 am

The next IP-SoC conference will be held in Grenoble, France, on December 6-7, 2016 after Shanghai in September and Bangalore, India, in April. This will be the 20[SUP]th[/SUP] edition of this unique IP centric event, as well as the celebration of Design And Reuse 20[SUP]th[/SUP] anniversary. Creating in 1997 a company fully dedicated… Read More


Foundry CAPEX Jumped from 17% to 37% of LAM Business

Foundry CAPEX Jumped from 17% to 37% of LAM Business
by Robert Maire on 10-23-2016 at 4:00 pm

Lam- in line qtr but guides above street over near term. As with ASML, foundry is driver with subdued memory, The Math implies biz peaking-Looking for DRAM in 2017.

Lam reported another great, record quarter, more or less in line with expectations with revenues coming in at $1.632B and shipments of $1.708B, generating EPS of $1.81.… Read More


What is the impact of missing the 7NM node with EUV?

What is the impact of missing the 7NM node with EUV?
by Robert Maire on 10-23-2016 at 12:00 pm

ASML reported a quarter that was slightly below expectations coming in at Euro 1.815B in revenues and Euro 0.93 EPS. Orders were a bit soft at Euro 1.4B but well within the normal quarterly variation of a lumpy business. Euro 28M was lost in a currency adjustment associated with the Hermes acquisition.

The guidance for Q4 was between… Read More


Webinar Offers View into TSMC IP Design Methodology

Webinar Offers View into TSMC IP Design Methodology
by Tom Simon on 10-21-2016 at 12:00 pm

Standard cell and memory IP are key enablers for new process node availability. These two items must be in place early and be completely ready for a process node to scale to volume. Development of both leaves no room for error and they require the highest performance possible. Foundries are extremely focused on this and spend a lot… Read More


CEO Interview: Geoff Tate of Flex Logix

CEO Interview: Geoff Tate of Flex Logix
by Daniel Nenni on 10-10-2016 at 7:00 am

Geoff Tate Flexlogix

This is the second in series of interviews we will do with executives inside the fabless semiconductor ecosystem. Geoff Tate was the founding CEO of Rambus and is now CEO and co-founder of Flex Logix (embedded FPGA). This one should be of great interest due to the recent $16.7B acquisition of Altera by Intel. We all now know the importance… Read More


16nm HBM Implementation Presentation Highlights CoWoS During TSMC’s OIP

16nm HBM Implementation Presentation Highlights CoWoS During TSMC’s OIP
by Tom Simon on 09-29-2016 at 12:00 pm

Once a year, during the TSMC’s Open Innovation Platform (OIP) Forum you can expect to see cutting edge technical achievements by TSMC and their partners. This year was no exception, with Open-Silicon presenting its accomplishments in implementing an HBM reference design in 16nm. It’s well understood that HBM offers huge benefits… Read More