At IEDM this December Imec presented “Interconnect metals beyond copper – reliability challenges and opportunities”. In addition to seeing the paper presented I had a chance to interview one of the authors, Kristof Croes. Replacements for copper are a hot subject and I will summarize the challenges and Imec’s work.… Read More
At IEDM last week Anthony (Tony) Yen, Vice President and Head, Technology Development Centers Worldwide for ASML presented a paper entitled “EUV Lithography at Threshold of High-Volume Manufacturing” authored by Anthony Yen, Hans Meiling, and Jos Benschop. At IEDM I had a chance to sit down with Tony and discuss the paper and … Read More
IEDM is a premier semiconductor conference so it was certainly appropriate for Samsung to do the keynote since they are the largest and one of the most innovative semiconductor companies in the world, absolutely.
Samsung is also one of the more interesting semiconductor companies since they do it all: chip design, semiconductor… Read More
Growing up in a military family, mostly in California, I would consider my cultural diversity life experience to be more than most. I remember in the 1960s some older folks were chattering about a colored family moving into our neighborhood and they had a son my age. Imagine my excitement as a child in having a multicolored friend!… Read More
Aristotle once said “The whole is greater than the sum of its parts”. The notion of synergism echoes the importance of leveraging design IPs to the maximum extent with the rest of the system under development, in order to ensure a successful SoC design outcome in a shorter development cycle.
SoC design cost and entry point
For over… Read More
Semiconductor stocks have had another significant down leg as the bad news continues to pile on. Bad news in this case doesn’t come in threes , it comes in droves. TI is perhaps very scary news as it is a rather broad based supplier of semiconductors that has fared better than more pure play chip suppliers. TI gave weak guidance… Read More
When TSMC’s annual Open Innovation Platform Exposition takes place, you know it will be time to hear about designs starting on the most advanced nodes. This year we were hearing about 7nm and 5nm. These newer nodes present even more challenges than previous nodes due to many factors. Regardless of what kind of design you are undertaking… Read More
The TSMC OIP Forum was very upbeat this year and now we know why. It wasn’t long ago that some media outlets and a competitor said 7nm would not be a popular node because it is too expensive blah blah blah. People inside the fabless semiconductor ecosystem however know otherwise. As I have said before, 7nm will be another strong node … Read More
The “20 Questions with Wally Rhines” series continues
Throughout the history of the EDA industry, pricing models have caused discontinuities in the way the industry operates. For a variety of competitive reasons, individual companies have developed ways to change the pricing model in an attempt to secure competitive… Read More
EDA has been flirting with the cloud unsuccessfully for many years now and it really comes down to a familiar question: Who can afford to spend billions of dollars on data center security? Which is similar to the question that started the fabless transformation: Who can afford to spend billions of dollars on semiconductor manufacturing… Read More
