SPIE 2017 ASML and Cadence EUV impact on place and route

SPIE 2017 ASML and Cadence EUV impact on place and route
by Scotten Jones on 04-13-2017 at 7:00 am

As feature sizes have shrunk, the semiconductor industry has moved from simple, single-exposure lithography solutions to increasingly complex resolution-enhancement techniques and multi-patterning. Where the design on a mask once matched the image that would be produced on the wafer, today the mask and resulting image … Read More


SPIE 2017: Irresistible Materials EUV Photoresist

SPIE 2017: Irresistible Materials EUV Photoresist
by Scotten Jones on 04-11-2017 at 7:00 am

Irresistible Materials (IM) is a spin-out of the University of Birmingham in the United Kingdom that has been doing research on Photoresist and Spin-On Carbon hard masks for 10 years, most recently with Nano-C on chemistry development. IM has developed a unique EUV photoresist and they are now looking for partners to help bring… Read More


Intel Manufacturing Day: Nodes must die, but Moore’s Law lives!

Intel Manufacturing Day: Nodes must die, but Moore’s Law lives!
by Scotten Jones on 03-29-2017 at 4:00 pm

Yesterday I attended Intel’s manufacturing day. This was the first manufacturing day Intel has held in three years and according to Intel their most in depth ever.

Nodes must die
I have written several articles comparing process technologies across the leading-edge logic producers – GLOBALFOUNDRIES, Intel, Samsung… Read More


EUV is NOT Ready for 7nm!

EUV is NOT Ready for 7nm!
by Daniel Nenni on 02-27-2017 at 8:00 am

The annual SPIE Advanced Lithography Conference kicked off last night with vendor sponsored networking events and such. SPIE is the international society for optics and photonics but this year SPIE Advanced Lithography is all about the highly anticipated EUV technology. Scotten Jones and I are at SPIE so expect more detailedRead More


SPIE Advanced Lithography and Synopsys!

SPIE Advanced Lithography and Synopsys!
by Daniel Nenni on 02-01-2017 at 7:00 am

SPIE is the premier event for lithography held in Silicon Valley and again Scotten Jones and I will be attending. EUV is generally the star of the show and this year will be no different now that TSMC has committed to EUV production in 2019.

Last year at SPIE, TSMC presented the history of EUV development from the beginning in 1985 as … Read More


GLOBALFOUNDRIES Extends the FDSOI Roadmap

GLOBALFOUNDRIES Extends the FDSOI Roadmap
by Scotten Jones on 09-19-2016 at 12:00 pm

On September 8, 2016 GLOBALFOUNDRIES (GF) announced their 12nm FDSOI technology node. On September 12th I had a chance to interview Greg Bartlett, GF Senior Vice President for the CMOS Business Unit (as a side note, GF has: RF SOI, ASIC and CMOS business units).… Read More


The 2016 Leading Edge Semiconductor Landscape

The 2016 Leading Edge Semiconductor Landscape
by Scotten Jones on 09-03-2016 at 7:00 am

The leading edge semiconductor logic landscape has in recent years collapsed to just four companies. The following is a summary of what is currently known about each company’s plans and how they compare. ASML has analyzed many logic nodes and developed a formula that normalizes processes to a “standard node”.… Read More


SPIE – Interview with Greg Mcintyre of IMEC

SPIE – Interview with Greg Mcintyre of IMEC
by Scotten Jones on 03-15-2016 at 7:00 am

One of the things I really like about major technical conferences is the opportunity to meet with people for networking and interviews. On Wednesday at the Advanced Lithography Conference I had the opportunity to interview Greg Mcinttyre, the director of advanced patterning at IMEC.

IMEC researchers are the first author on 32… Read More


IEDM Blogs – Part 7 – IMEC Technology Forum – Part 2

IEDM Blogs – Part 7 – IMEC Technology Forum – Part 2
by Scotten Jones on 01-08-2016 at 7:00 am

On Sunday evening December 6[SUP]th[/SUP] before IEDM, IMEC held the IMEC Technology Forum (ITF). In part 1 of this blog I discussed the introduction and the first two presentations given by An Steegen and Mark Rodder. In this blog I will discuss the final two presentations. Part 1 can be accessed here.… Read More


IEDM Blogs – Part 3 – Global Foundries 22FDX Briefing

IEDM Blogs – Part 3 – Global Foundries 22FDX Briefing
by Scotten Jones on 12-18-2015 at 12:00 pm

While I was at IEDM I had an opportunity to sit down with Subramani (Subi) Kengeri, the Vice President, General Management, CMOS Platforms Business Unit and Jason Gorss from corporate marketing at Global Foundries (GF) for a briefing on GF’s new 22FDX process technology.

Subi told me his background was in design but that he is now… Read More