Will my High-Speed Serial Link Work?

Will my High-Speed Serial Link Work?
by Daniel Payne on 04-30-2024 at 10:00 am

traditional flow min

PCB designers can perform pre-route simulations, follow layout and routing rules, hope for the best from their prototype fab, and yet design errors cause respins which delays the project schedule. Just because post-route analysis is time consuming doesn’t mean that it should be avoided. Serial links are found in many PCB designs,… Read More


WEBINARS: Board-Level EM Simulation Reduces Late Respin Drama

WEBINARS: Board-Level EM Simulation Reduces Late Respin Drama
by Don Dingee on 02-01-2022 at 6:00 am

Flat Z design and voltage ripple example in board-level EM simulation

Advanced board designs are fertile ground for misbehavior in time and frequency domains. Relying on intuition, then waiting until near-final product for power integrity (PI) or EMI testing almost guarantees board respins are coming. Lumped-parameter simulations of on-board power delivery networks (PDNs) struggle with … Read More


Apache/Ansys presents: 3DIC thermal, transmission lines, low frequency analysis

Apache/Ansys presents: 3DIC thermal, transmission lines, low frequency analysis
by Paul McLellan on 12-16-2012 at 10:00 pm

Late in January it is DesignCon at the Santa Clara convention center from January 28th-31st. Details are here.

On Tuesday from 11.05 to 11.45 Apache and Ansys will be presenting on Thermal Co-analysis of 3D IC/packages/system. This is being presented by a whole team of people: Stephen Pan, senior product specialist at ANSYS; Norman… Read More