For about a decade I am looking forward to seeing more of system level design and verification including high level synthesis (HLS), virtual prototyping, and system modeling etc. to come in the main stream of SoC design. Although the progress has been slow, I see it accelerating as more and more tools address the typical pain points… Read More
Tag: rtl
Complete SoC Debugging & Integration in a Single Cockpit
These days it’s common to expect large digital designs, analog blocks, custom IPs, glue logic, interfaces and interconnects all developed separately, perhaps by different vendors / teams, but integrated together in a single environment forming an SoC. The SoC can have multiple clock domains and can work in multiple modes of … Read More
Improve Test Robustness & Coverage Early in Design
In a semiconductor design, keeping the design testable with high test coverage has always been a requirement. However with shrinking technology nodes and large, dense SoC designs and complex logic structures, while it has become mandatory to reach close to 100% test coverage, it’s extremely difficult to cope with the explosion… Read More
Noise & Reliability of FinFET Designs – Success Stories!
I think by now there has been good level of discussion on FinFET technology at sub-20 nm process nodes and this is an answer to ultra dense, high performance, low power, and billion+ gate SoC designs within the same area. However, it comes with some of the key challenges with respect to power, noise and reliability of the design. A FinFET… Read More
Designing Hardware with C++ and its Advantages
Very recently, I was seeing intense discussions on the need for agile hardware development just like agile software and ideas were being sought from experts as well as individuals. While in software world it has already evolved, in hardware world it’s yet to see the shift in paradigm. My point is that the end goal of agile hardware… Read More
StarVision to Debug and Analyze Designs at All Levels
In today’s SoC world where multiple analog and digital blocks along with IPs at different levels of abstractions are placed together on a single chip, debugging at all levels becomes quite difficult and clumsy. While one is working at the top level and needs to investigate a particular connection at an intermediate hierarchical… Read More
What’s Behind Carbon System Exchange – How Will it Scale?
Earlier this year, when I was looking at Carbon’spast year performance which provided record breaking revenue with whopping jump in bookings, one thing was certain that Carbon Performance Analysis Kits (CPAKs) would drive major growth in future, not only for Carbon, but also for the semiconductor industry. It will initiate … Read More
Expansion at Calypto through Real Value Addition in SoC Design
When we get the notion of expansion of a company, it always provides a positive picture about something good happening to boost that expansion. There can be several reasons for expansion such as merger & acquisition, formation of joint venture or partnership, large customer orders and so on. However, organic expansion which… Read More
Power and Thermal Analysis of Data Center and Server ICs
The server market is a diverse, yet standardized market. The ICs and components designed and manufactured in final assemblies must meet form factor requirements for rack mount and blades. The form factor enclosures and the component placement dictate the thermal-mechanical properties and hence the thermal cooling limits … Read More
Automatic RTL Restructuring: A Need Rather Than Convenience
In the semiconductor design industry, most of the designs are created and optimized at the RTL level, mainly through home grown scripts or manual methods. As there can be several iterations in optimizing the hierarchy for physical implementation, it’s too late to do the hierarchical optimizations after reaching the floor plan… Read More