About 11 months ago, I wrote a piece titled “Money for data and your MEMS for free.” In that, I took on the thinking that TSMC is just going to ride into town, fab trillions of IoT sensors, and they all will be 2.6 cents ten years from now. Good headline, but the technology and economics are not that simple. This may be the semiconductor … Read More
Although I knew about Crossfire’s capabilities for signing off quality of an IP before its integration into an SoC, there was much more to learn about this tool when I visited Fractal Technologies booth during this DAC. The complexity handled by this tool to qualify any type of IP for its integration into an SoC can be imagined by the… Read More
When it comes to wearable technology and the rapidly emerging world of IoT, sensors and MEMS are on the frontlines. They collect and transfer raw data such as pressure, temperature and motion and process it with algorithms critical to making sure the right information gets to humans and/or machines so the right reaction is enabled.… Read More
For any semiconductor technology node to be adopted in actual semiconductor designs, the very first step is to have a Process Design Kit (PDK) developed for that particular technology node and qualified through several design tools used in the design flow. The development of PDK has not been easy; it’s a tedious, time consuming,… Read More
Today was TSMC’s 2015 North American Technology Symposium. They talked about a lot of things but perhaps the most important was that they gave a lot of details of new processes, new fabs, and volume ramps.… Read More
The Internet of Things (IoT) is clearly the buzzword of the moment, and like many catchy phrases it also tends to mean what you want it to mean, rolling up some things that exist like the automotive market or industrial automation, along with markets for things like wearables and healthcare that are largely in the future. But however… Read More
‘Laughing Buddha’ is eternal, but for semiconductor industry, I must say it’s ‘laughing Moore’. Moore made a predictive hypothesis and the whole world is inclined to let that continue, eternally? When we were at 28nm, we weren’t hoping to go beyond 20/22nm; voices like ‘Moore’s law is dead’ started emerging. Today, we are already… Read More
So what comes after FinFETs? At 14/16nm (or 22nm if you are Intel) we had FinFET transistors, where the channel was no longer planar but stuck out of the wafer vertically, and the gate wrapped around it on 3 sides. The key thing that made FinFET transistors attractive was that the channel was thin so that the gate controlled it well. … Read More
MEMS design and fabrication is highly complex in the sense that the fabrication process heavily depends on the design, unlike IC fabrication which has a standard set of processes. A slight change in MEMS design can alter its fabrication steps to a large extent. For example, setting device parameters such as capacitance or linear… Read More
The growing process integration complexity at each technology node has increased development time and cost, and this trend looks to continue. There is a looming risk of delivering unrepeatable critical unit processes (or process modules) that would require revisiting development and manufacturing requalification or in … Read More
