The “1.xnm” node on most roadmaps to indicate a 16-18 nm metal line pitch [1]. The center-to-center spacing may be expected to be as low as 22-26 nm (sqrt(2) times line pitch). The EXE series of EUV (13.5 nm wavelength) lithography systems from ASML feature a 0.55 “High” NA (numerical aperture), targeted… Read More
Tag: euv
LAM Not Yet at Bottom Memory Worsening Down 50%
-Lam reported in line results on reduced expectations
-Guidance disappoints as memory decline continues
-Memory capex down 50% but still sees “further declines”
-Lam ties future to EUV maybe not good idea after ASML report
Lam comes in above grossly already reduced expectations
and misses on guidance
We always … Read More
ASML Wavering- Supports our Concern of Second Leg Down for Semis- False Bottom
-ASML weakness is evidence of deeper chip down cycle
-When ASML sneezes other chip equip makers catch a cold
-Will backlog last long enough? Will EUV demand hold up?
-“Unthinkable” event, litho cancelations, could shock industry
ASML has in line quarter but alarm bells ring on wavering outlook
ASML reported Euro6.7B… Read More
Can Attenuated Phase-Shift Masks Work For EUV?
Normalized image log-slope (NILS) is probably the single most essential metric for describing lithographic image quality. It is defined as the slope of the log of intensity, multiplied by the linewidth [1], NILS = d(log I)/dx * w = w/I dI/dx. Essentially, it gives the % change in width for a given % change in dose. This is particularly… Read More
SPIE Advanced Lithography Conference 2023 – AMAT Sculpta® Announcement
The SPIE Advanced Lithography Conference is the semiconductor industries premier conference on lithography. The 2023 conference was held the week of February 27th and at the conference Applied Materials announced their Sculpta® pattern shaping tool. Last week I had an opportunity to interview Steven Sherman the Managing … Read More
Report from SPIE- EUV’s next 15 years- AMAT “Sculpta” braggadocio rollout
-We attended the SPIE lithography Conference in San Jose
-No significant news or announcements on EUV
-Focus on 500WPM target and High & Hyper NA rollout
-AMAT overblown Sculpta-Not exactly what its cracked up to be
SPIE Lithography 2023
We have been attending SPIE for many years now and are happy to see a return to pre Covid levels… Read More
Resolution vs. Die Size Tradeoff Due to EUV Pupil Rotation
The many idiosyncrasies of EUV lithography affect the resolution that can actually be realized. One which still does not get as much attention as it should is the cross-slit pupil rotation [1-3]. This is a fundamental consequence of using rotational symmetry in ring-field optical systems to control aberrations in reflective… Read More
U.S., Japan & Dutch versus China Chips & Memory looks to be in a long downturn
-US, Japan & Dutch agree to embargo some China chip equip
-Goes beyond just leading edge & will increase negative impact
-China might catch up in decades or invade Taiwan tomorrow
-Why the memory downturn could be longer than expected
Ganging up on China
It appears that the US has put together a coalition of the US, Japan and… Read More
ASML – Powering through weakness – Almost untouchable – Lead times exceed downturn
-Demand far exceeds supply & much longer than any downturn
-Full speed ahead-$40B in solid backlog provides great comfort
-ASP increase shows strength- China is non issue
-In a completely different league than other equipment makers
Reports a good beat & Guide
Revenues were Euro6.4B with system sales making up Euro4.7B… Read More
Secondary Electron Blur Randomness as the Origin of EUV Stochastic Defects
Stochastic defects in EUV lithography have been studied over the last few years. For years, the Poisson noise from the low photon density of EUV had been suspected [1,2]. EUV distinguishes itself from DUV lithography with secondary electrons functioning as intermediary agents in generating reactions in the resist. Therefore,… Read More