On the heels of successful seminars in Tokyo and Shanghai, eSilicon is starting the new year back in the cloud with a webinar version of the live events for those, like myself, who could not attend. The webinar will compress the 3 hour live event into 60 minutes which will provide a great place to start a conversation on your next chip… Read More
One of the more exciting design start market segments that we track is Artificial Intelligence related ASICs. With NVIDIA making billions upon billions of dollars repurposing GPUs as AI engines in the cloud, the Application Specific Integrated Circuit business was sure to follow. Google now has its Tensor Processing Unit, Intel… Read More
In 1969 the Internet was born at UCLA when a computer there sent a message to a computer at Stanford. By 1975, there were 57 computers on the ‘internet’. Interestingly in the early seventies I actually used the original Xerox Sigma 7 connected to the internet in Boelter Hall at UCLA. A similar vintage computer is now in this room commemorating… Read More
The first transistor was made of two electrodes, held in place by plastic, making contact with a piece of doped germanium. Ever since then, devices and their packaging have been performing a complicated and oftentimes intricate dance. Single transistor devices became integrated circuits, and along the way separate IC’s were… Read More
As you all know I’m a big fan of the ASIC business dating back to the start of the fabless semiconductor transformation where anybody could send a design spec to an ASIC company and get a chip back. The ASIC business model also started the smart phone revolution when Samsung built the first Apple SoCs for the iPhones and iPads.
Today … Read More
eSilicon presented their advanced ASIC design capabilities at a seminar last Wednesday evening. This event was closed to the press, bloggers and analysts, but I managed to get some details from a friend who attended. The event title was: “Advanced ASICs for the Cloud-Computing Era: Succeeding with 56G SerDes, HBM2, 2.5D and FinFET… Read More
Last week Samsung hosted the GSA Silicon Valley “State of the Industry” Meet-up which was well attended by the semiconductor elite, myself included. The agenda started with an update on the semiconductor industry outlook followed by deep dives into Automotive, IoT, Artificial Intelligence, and Cybersecurity all of which are… Read More
I recently spoke with Jack Harding, CEO of eSilicon Corporation and Duy-Loan Le, one of eSilicon’s Board members about eSilicon’s progress in Vietnam, a large design location for the company. eSilicon also gives back in the region through its association with Sunflower Mission, a U.S. based non-profit organization that is committed… Read More
With memories taking up in some cases over 50% of the area of many ASIC designs, their selection and implementation can affect everything from power and timing to the choice of packaging. As a result, the process of deciding among all the options for ASIC memories becomes time and energy intensive. Memory selection even affects … Read More
Knowledge is power, and I’ve seen the trend over time of people getting more and deeper access to knowledge as each year goes by. I remember, as a student in high school back the in 70’s, the first time I wanted to buy stock in a company. You could only get a quote by calling a broker or visiting the broker’s office. Today you can get real … Read More
