Overcoming System-Level 3D-IC Electrical and Thermal Challenges

Overcoming System-Level 3D-IC Electrical and Thermal Challenges
by Admin on 04-06-2022 at 12:00 am

Overview

Electronics products with 3D-ICs face growing system challenges related to signal, power, and thermal integrity. Design density can lead to performance issues caused by heat, crosstalk, and power noise.

Addressing these concerns through simulation during system planning and continuing through signoff will accelerate… Read More


Let’s Drive To Dearborn on 19th Sep….

Let’s Drive To Dearborn on 19th Sep….
by Pawan Fangaria on 08-15-2013 at 11:00 am


[The VLC developed by Edison2, winner of the Progressive Automotive X-Prize]

Now that we have “The Very Light Car” of the world at more than 100 MPG!! Yes, this is the car developed by Edison2, one among the three winners of the Progressive Insurance Automotive X-Prize, a global competition; Edison2 won in the main stream class. … Read More