Cadence’s Signoff Summit will be held next week, November 21 at Cadence in San Jose.
This is the first of a series of all-day Signoff Summits from Cadence that focus on the multiple facets of design signoff. This first summit will include keynote addresses plus sessions covering the multiple solution components that comprise… Read More
In EDA we have come to expect that only small start-up companies create new tools, however a team at Cadencehas developed a new IC power integrity tool called Voltus from scratch. To learn more I spoke last week with KT Moore, a Group Director at Cadence. I’ve known KT for over a decade, and first met him when he was at Magma marketing… Read More
The growing process integration complexity at each technology node has increased development time and cost, and this trend looks to continue. There is a looming risk of delivering unrepeatable critical unit processes (or process modules) that would require revisiting development and manufacturing requalification or in … Read More
At the Jasper Users’ Group, Alex Netterville of ARM presented about how ARM are using formal on an unannounced processor code-named Pelican. Don’t read the presentation trying to find out information about Pelican itself, there isn’t any. That wasn’t the topic. Alex has been using formal approaches… Read More
Milandr is a company based in Moscow that makes high reliability semiconductor components for the aerospace, automotive and consumer markets, primarily in Russia. They work with multiple foundries, including X-FAB and TSMC in technologies from 1um down to 65nm. Corporate headquarter and main IC design house is located in Russian… Read More
Dassault have recently been granted a patent on their approach to managing design hierarchy. I asked them how long it took from filing the patent until it was granted and they said the whole process had taken 8 years. It is a bit of an indictment of the patent system when it takes 8 years, also known as 4 or 5 process nodes, for a patent to… Read More
I was the VP marketing at VaST Systems Technology and then at Virtutech. Both companies sold virtual platform technology which consisted of two parts:
Major power reductions are possible by reducing power at the RTL and system levels, and not just at the gate and physical level. In fact, as is so often the case in design, changes can have much more impact when done at the higher level, even given that at that point in the design there is less accurate feedback about changes. Later the… Read More
I am at ARM TechCon today. One interesting presentation was made jointly between Samsung, Cadence and ARM themselves about developing physical libraries (ARM), a tool flow (Cadence) and test chips (Samsung). It was titled Samsung ARM and Cadence collaborate on the silicon-proven world first 14-nm FinFET Cortex-A7 ARM CPU and… Read More
As semiconductors become more integrated into our lives reliability is becoming a critical issue. As IP consumes more of our die, IP reliability is becoming a critical issue. As we pack more transistors into a chip, reliability is becoming a critical issue. As we move from 28nm to 20nm to 16nm, reliability is becoming a critical … Read More
