Tag: data center

Webinar: Simulation for Data Center Cooling Infrastructure

Webinar: Simulation for Data Center Cooling Infrastructure
by Admin on 09-03-2026 at 1:50 am

AI ready data centers are reshaping cooling infrastructure, with the industry moving from traditional air cooling toward hybrid and liquid cooling architectures to support higher rack densities and stricter efficiency targets. Join this webinar to explore how simulation supports faster decisions, reduced risk, improved

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The Shift to System-Level AI Drives Next-Generation Silicon

The Shift to System-Level AI Drives Next-Generation Silicon
by Kalar Rajendiran on 04-27-2026 at 8:00 am
Categories: 3D IC, AI, Chiplet, FinFET, Semiconductor, TSMC

TSMC Advanced Technology Roadmap

At its 2026 Technology Symposium, TSMC delivered a clear message: the AI era has entered a new phase. The primary constraint is no longer model capability, but the systems required to run those models at scale. Addressing this shift will demand significant advances in semiconductor technology, spanning compute, memory, interconnects,… Read More

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TSMC vs Intel Foundry vs Samsung Foundry 2026

TSMC vs Intel Foundry vs Samsung Foundry 2026
by Daniel Nenni on 02-13-2026 at 6:00 am
Categories: FinFET, GAA, Intel Foundry, Samsung Foundry, Semiconductor, TSMC
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TSMC vs Intel Foundry vs Samsung Foundry

The global semiconductor industry sits at the foundation of modern technology, powering everything from smartphones and cloud data centers to artificial intelligence, automobiles, and national defense systems. At the center of advanced chip manufacturing are three major players: TSMC, Samsung Foundry, and Intel Foundry… Read More

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Achieving 400W Thermal Envelope for AI Datacenter SoCs

Achieving 400W Thermal Envelope for AI Datacenter SoCs
by Kalar Rajendiran on 12-05-2022 at 10:00 am
Categories: Alchip, Events, FinFET, Semiconductor Services, TSMC
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Alchip BlockDiagram Oct 26 2022 tsmc na oip presentation

Successful ASIC providers offer top-notch infrastructure and methodologies that can accommodate varied demands from a multitude of customers. Such ASIC providers also need access to best-in-class IP portfolio, advanced packaging and test capabilities, and heterogeneous chiplet integration capability among other things.… Read More

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CEO Interview: Frankwell Lin, Chairman and CEO of Andes Technology

CEO Interview: Frankwell Lin, Chairman and CEO of Andes Technology
by Daniel Nenni on 03-11-2022 at 6:00 am
Categories: Andes Technology, CEO Interviews, IP, RISC-V

Frankwell Jyh Ming Lin

Frankwell Lin, Chairman of Andes Technology, started his career being as application engineer in United Microelectronics Corporation (UMC) while UMC was an IDM with its own chip products, he experienced engineering, product planning, sales, and marketing jobs with various product lines in UMC. In 1995, after four years working… Read More

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Optimize RTL and Software with Fast Power Verification Results for Billion-Gate Designs

Optimize RTL and Software with Fast Power Verification Results for Billion-Gate Designs
by Johannes Stahl on 07-28-2021 at 10:00 am
Categories: 5G, AI, EDA, Mobile, Synopsys

ZeBu Empower diagram

In every chip, power is a progressive problem to be solved. Designers have long had to rely on a combination of experience and knowledge to tackle this dilemma, typically having to wait until after silicon availability to perform power analysis with realistic software workloads. However, this is too late in the game, as it becomes… Read More

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Achronix Speedster7t Garners Best Practices Award for FPGA

Achronix Speedster7t Garners Best Practices Award for FPGA
by Tom Simon on 01-11-2021 at 10:00 am
Categories: Achronix, eFPGA

Frost and Sullivan 2020 Award Achronix

FPGAs have played an important role in the growth of key markets, including networking, storage, mobile devices, etc. They offer a unique set of capabilities that ASICs, CPUs and GPUs find hard to match. FPGAs are wire-speed, programmable integrated circuits that accelerate data and applications.  The ability to reprogram … Read More

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In-Chip Monitoring Helps Manage Data Center Power

In-Chip Monitoring Helps Manage Data Center Power
by Tom Simon on 09-07-2020 at 6:00 am
Categories: Events, IP, Moortec, TSMC
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in-chip sensing

Designers spend plenty of time analyzing the effects of process, voltage and temperature. But everyone knows it’s not enough to simply stop there. Operating environments are tough and have lots of limitations, especially when it comes to power consumption and thermal issues. Thermal protection and even over-voltage protections… Read More

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Talking Sense With Moortec … Ask Yourself a “Probing” Question?

Talking Sense With Moortec … Ask Yourself a “Probing” Question?
by Ramsay Allen on 07-16-2020 at 10:00 am
Categories: IP, Moortec

Managing and controlling thermal conditions in-chip is nothing new and embedded temperature monitoring has been going on for many years. What is changing however, is the granularity and accuracy of the sensing now available to SoC design teams. Thermal activity can be quite destructive and if not sufficiently monitored can … Read More

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Achronix Announces New Accelerator Card at Linley Fall Processor Conference – VectorPath

Achronix Announces New Accelerator Card at Linley Fall Processor Conference – VectorPath
by Randy Smith on 11-04-2019 at 10:00 am
Categories: Achronix, eFPGA, Events, FPGA

This blog is my second blog from this year’s Linley Fall Processor Conference. The first two blogs focused on edge inference solutions. Achronix’s discussion was much broader than just AI/ML; it was about where FPGA’s have been going and culminated with a product announcement preview. I’ll get to the announcement in a moment, … Read More