ICSJ 2026

ICSJ 2026
by Admin on 10-28-2026 at 12:52 am

“IEEE CPMT Symposium Japan (ICSJ)” is one of the most widely recognized international conferences sponsored by the IEEE Electronics Packaging Society (EPS) and is held annually in Kyoto every November. This conference was inaugurated in 1992 as “The VLSI Packaging Workshop in Japan (VPWJ)” to provide… Read More

EE Times AI Everywhere 2026

EE Times AI Everywhere 2026
by Admin on 10-27-2026 at 11:15 pm

Description

AI is no longer just running on the system—it’s reshaping how the system is designed. Agentic AI is changing the demands on chips, architectures, memory, networking, software, and the entire compute stack. From AI-native silicon and advanced packaging to intelligent system architectures and autonomous design

RISC-V Summit North America 2027

RISC-V Summit North America 2027
by Admin on 10-27-2026 at 10:43 pm

RISC-V Summit North America 2027 is taking place from February 16 to 18 at the Hyatt Regency, Embarcadero in San Francisco, California. February 16 is Member Day and the main conference will begin on February 17.

RISC-V is defining the future of open computing by providing unprecedented freedom to innovate. SHD Group estimates

AI Infra Summit 10X 2027

AI Infra Summit 10X 2027
by Admin on 10-19-2026 at 1:32 am

About AI Infra Summit 10X

AI Infra Summit 10X is the only place in the industry where every layer of the stack is in the same room.

The summit brings together 12,000 people who are already building the infrastructure AI runs on: the chips, the interconnects, the data centres, the networking layers, the storage. Three days in San Jose

Webinar: Simulation for Data Center Cooling Infrastructure

Webinar: Simulation for Data Center Cooling Infrastructure
by Admin on 09-03-2026 at 1:50 am

AI ready data centers are reshaping cooling infrastructure, with the industry moving from traditional air cooling toward hybrid and liquid cooling architectures to support higher rack densities and stricter efficiency targets. Join this webinar to explore how simulation supports faster decisions, reduced risk, improved

April 27, 2026April 27, 2026

The Shift to System-Level AI Drives Next-Generation Silicon

The Shift to System-Level AI Drives Next-Generation Silicon
by Kalar Rajendiran on 04-27-2026 at 8:00 am
Categories: 3D IC, AI, Chiplet, FinFET, Semiconductor, TSMC

At its 2026 Technology Symposium, TSMC delivered a clear message: the AI era has entered a new phase. The primary constraint is no longer model capability, but the systems required to run those models at scale. Addressing this shift will demand significant advances in semiconductor technology, spanning compute, memory, interconnects,… Read More

February 13, 2026October 5, 2026

TSMC vs Intel Foundry vs Samsung Foundry 2026

TSMC vs Intel Foundry vs Samsung Foundry 2026
by Daniel Nenni on 02-13-2026 at 6:00 am
Categories: FinFET, GAA, Intel Foundry, Samsung Foundry, Semiconductor, TSMC
2 Comments

The global semiconductor industry sits at the foundation of modern technology, powering everything from smartphones and cloud data centers to artificial intelligence, automobiles, and national defense systems. At the center of advanced chip manufacturing are three major players: TSMC, Samsung Foundry, and Intel Foundry… Read More

December 5, 2022December 9, 2022

Achieving 400W Thermal Envelope for AI Datacenter SoCs

Achieving 400W Thermal Envelope for AI Datacenter SoCs
by Kalar Rajendiran on 12-05-2022 at 10:00 am
Categories: Alchip, Events, FinFET, Semiconductor Services, TSMC
2 Comments

Alchip BlockDiagram Oct 26 2022 tsmc na oip presentation

Successful ASIC providers offer top-notch infrastructure and methodologies that can accommodate varied demands from a multitude of customers. Such ASIC providers also need access to best-in-class IP portfolio, advanced packaging and test capabilities, and heterogeneous chiplet integration capability among other things.… Read More

March 11, 2022September 13, 2022

CEO Interview: Frankwell Lin, Chairman and CEO of Andes Technology

CEO Interview: Frankwell Lin, Chairman and CEO of Andes Technology
by Daniel Nenni on 03-11-2022 at 6:00 am
Categories: Andes Technology, CEO Interviews, IP, RISC-V

Frankwell Lin, Chairman of Andes Technology, started his career being as application engineer in United Microelectronics Corporation (UMC) while UMC was an IDM with its own chip products, he experienced engineering, product planning, sales, and marketing jobs with various product lines in UMC. In 1995, after four years working… Read More

July 28, 2021July 18, 2025

Optimize RTL and Software with Fast Power Verification Results for Billion-Gate Designs

Optimize RTL and Software with Fast Power Verification Results for Billion-Gate Designs
by Johannes Stahl on 07-28-2021 at 10:00 am
Categories: 5G, AI, EDA, Mobile, Synopsys

In every chip, power is a progressive problem to be solved. Designers have long had to rely on a combination of experience and knowledge to tackle this dilemma, typically having to wait until after silicon availability to perform power analysis with realistic software workloads. However, this is too late in the game, as it becomes… Read More