The ASP-DAC 2024 Organizing Committee has prepared a total of 4 Keynote Speeches for this year, and it has been decided to integrate one of these Keynote Speeches with the Banquet. In order to provide a more enriching experience for a greater number of attendees, the Banquet… Read More
The heterogeneous integration of chips/chiplets has added significant complexity to the IC package design process, further compressing schedules for many design teams. Design teams must work more efficiently to meet quality and performance goals while maintaining schedule milestones.
One way to improve efficiency is to… Read More
SEMI has invited key stakeholders from Ohio to discuss state initiatives that can be leveraged in alignment with current and upcoming CHIPS Funding opportunities. Webinar participants will learn why Ohio is a premier location for semiconductor… Read More
Technical standards for digital twin capabilities in the semiconductor and microelectronics industry will be the subject of a December workshop sponsored by the CHIPS Research and Development Office. The workshop will be a hybrid in-person and virtual event from 8:30 a.m. to 5:30 p.m. Eastern Time December 14, 2023, and 8:30… Read More
The CHIPS Research and Development Office’s Chiplets Interfaces Technical Standards Workshop will be held as a hybrid in-person and virtual event from 8:30 a.m. to 5:30 p.m. Eastern Time December 12, 2023, and 8:30 am to 12:30 pm December 13, 2023. This event will bring together technical experts from industry, academia, standards… Read More
The Designing Chips with CHIPS: West Coast Pre-Silicon Summit is a one-day semi summit that will bring together leading thinkers from chip design and packaging companies,
Title: WEBINAR l System-Level Thermal Signoff from Chips Through to Racks
Date: Wednesday, October 18, 2023
Time: 10:00 AM Eastern Daylight Time
Duration: 45 minutes
Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and
Beyond The Hype
The USA has signaled its intention to take a lead in 6G with provisions in, among others, the $280bn CHIPS and Science act. Canada is also investing heavily to play a major role. While some of the technology directions for 6G are becoming clearer, reaching those aspirations through the
Chiplet-based SoC architectures have seen increased interest over the past three years, and recently were made a focus of the federal CHIPS and Science Act to reduce the cost of innovation for US-based semiconductor startups, DoD projects, and academic research. Chiplet-based architectures bring their own set of challenges… Read More
