Title: WEBINAR l System-Level Thermal Signoff from Chips Through to Racks
Date: Wednesday, October 18, 2023
Time: 10:00 AM Eastern Daylight Time
Duration: 45 minutes
Summary
Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and
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Chiplet-based SoC architectures have seen increased interest over the past three years, and recently were made a focus of the federal CHIPS and Science Act to reduce the cost of innovation for US-based semiconductor startups, DoD projects, and academic research. Chiplet-based architectures bring their own set of challenges… Read More
Technology has the potential to solve the world’s most difficult challenges. When you design semiconductors, you become the key to making that technology work. Chips provide the foundation and computing power for a wide range of emerging technologies – artificial intelligence (AI), the Internet of Things (IoT), 5G, healthcare… Read More
Date: April 19, 2022 at 8 a.m. PT
Schedule:
- Welcome / Opening Remarks: Rob Mains, CHIPS Alliance
- Chisel/FIRRTL Ecosystem Updates: Jack Koenig, SiFive
- F4PGA Group Kickoff, Interchange Format: Karol Gugala, Antmicro
- Chiplet Protocol IP: David Kehlet, Intel
- NIST (Cryo Test Structures): Mehdi Saligane, UMICH
- NVMe FPGA IP for
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Discussions of chiplets has been on the rise, ever since the slowdown of Moore’s law benefits. Gartner Research projects semiconductor revenue from systems using chiplets to grow from $3.3 billion in 2020, to $50.5 billion in 2024. With any market opportunity, there are always challenges to overcome in order to realize the full… Read More
