FinFETs, Power Integrity and Chip/Package Co-design

FinFETs, Power Integrity and Chip/Package Co-design
by Bernard Murphy on 02-18-2016 at 7:00 am

FinFETs have brought a lot of good things to design – higher performance, higher density and lower leakage power – promising to extend Moore’s law for a least a while longer. But inevitably with new advances come new challenges, especially around optimizing for power integrity in these designs.

One of these challenges is… Read More